Semiconductor device and programming method

• US 8,900,928 B2
• Filed: 08/16/2013
• Issued: 12/02/2014
• Est. Priority Date: 01/17/2006
• Status: Active Grant

• Current Assignee: Monterey Research, LLC (Vector Capital Corporation)
• Original Assignee: Spansion LLC (Infineon Technologies AG)
• Inventors: Taya, Koji, Onodera, Masanori
• Primary Examiner(s): Clark, S. V.
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US13/969,207
• Publication Number:
  US 20140035170A1
• Time in Patent Office: 473 Days
• Field of Search: 257/686, 257/685, 257/790, 257/E23.123, 438/124, 438/109
• US Class Current: 438/124
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 23/28 Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

Claims

1. A method for fabricating a semiconductor device comprising:

mounting a semiconductor chip on a chip mounting portion;

disposing a sheet-shaped resin in contact with the semiconductor chip;

coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin; and

forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.

2. The method as claimed in claim 1, wherein disposing the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip.

3. The method as claimed in claim 2, wherein forming the resin sealing portion includes:

disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and

sealing the semiconductor chip with the uncured resin.

4. The method as claimed in claim 1, wherein forming the resin sealing portion comprises forming the resin sealing portion by transfer molding.

5. The method as claimed in claim 1, wherein the sheet-shaped resin does not include a filler.

6. The method as claimed in claim 1, wherein forming the resin sealing portion comprises partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.

7. The method as claimed in claim 1, wherein disposing the sheet-shaped resin comprises disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion.

8. The method as claimed in claim 1, wherein the semiconductor chip comprises stacked semiconductor chips.

9. A system comprising:

means for mounting a semiconductor chip on a chip mounting portion;

means for disposing the sheet-shaped resin comprises disposing the sheet-shaped resin in contact with the semiconductor chip;

means for coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin;

means for forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.

10. The system as claimed in claim 9, wherein the disposing of the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip.

11. The method as claimed in claim 10, wherein the means for forming the resin sealing portion includes:

means for disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and

means for sealing the semiconductor chip with the uncured resin.

12. The method as claimed in claim 9, wherein the resin sealing portion is formed by transfer molding.

13. The method as claimed in claim 9, wherein the sheet-shaped resin does not include a filler.

14. The method as claimed in claim 9, wherein forming the resin sealing portion comprises partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.

15. The method as claimed in claim 9, wherein the disposing of the sheet-shaped resin comprises disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion.

16. The method as claimed in claim 9, wherein the semiconductor chip comprises stacked semiconductor chips.

17. A method for fabricating a semiconductor device comprising:

mounting a semiconductor chip on an upper die portion;

disposing a sheet-shaped resin on a lower die portion, wherein the sheet-shaped resin is disposed in contact with the semiconductor chip;

coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin;

assembling the upper die portion and the lower die portion; and

sealing the semiconductor chip with a sealing resin, wherein the sealing resin forms a resin sealing portion between the sheet-shaped resin and the upper die portion, to seal the semiconductor chip.

18. The method as claimed in claim 17, wherein the resin sealing portion is formed by transfer molding.

19. The method as claimed in claim 17, wherein the sheet-shaped resin does not include a filter.

20. The method as claimed in claim 17, wherein the semiconductor chip comprises stacked semiconductor chips.