Direct external interconnect for embedded interconnect bridge package
First Claim
1. A semiconductor package comprising:
- a substrate;
a first semiconductor die having a first bridge interconnect region;
a second semiconductor die having a second bridge interconnect region;
a bridge embedded in the substrate, the bridge having a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region; and
an external connection rail extending between the interconnect bridge and the first and second semiconductor dies to supply an external connection to the first and second bridge interconnect regions.
1 Assignment
0 Petitions
Accused Products
Abstract
An external direct connection usable for an embedded interconnect bridge package is described. In one example, a package has a substrate, a first semiconductor die having a first bridge interconnect region, and a second semiconductor die having a second bridge interconnect region. The package has a bridge embedded in the substrate, the bridge having a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region, and an external connection rail extending between the interconnect bridge and the first and second semiconductor dies to supply external connection to the first and second bridge interconnect regions.
-
Citations
11 Claims
-
1. A semiconductor package comprising:
-
a substrate; a first semiconductor die having a first bridge interconnect region; a second semiconductor die having a second bridge interconnect region; a bridge embedded in the substrate, the bridge having a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region; and an external connection rail extending between the interconnect bridge and the first and second semiconductor dies to supply an external connection to the first and second bridge interconnect regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A semiconductor package comprising:
-
a substrate; a first semiconductor die having a first bridge interconnect region; a second semiconductor die having a second bridge interconnect region; means embedded in the substrate for bridging connections between the first semiconductor die and the second semiconductor die, the means for bridging having a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region; and means for externally connecting power, the external power means having an external connection rail extending between the means for bridging and the first and second semiconductor dies to supply external connections to the first and second bridge interconnect regions. - View Dependent Claims (11)
-
Specification