Wireless integrated circuit device and method of manufacturing the same

• US 8,905,296 B2
• Filed: 08/08/2013
• Issued: 12/09/2014
• Est. Priority Date: 12/01/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Mukai, Tsuyoshi
• Primary Examiner(s): Le, Thien M
• Assistant Examiner(s): LY, TOAN C
• Application Number:
  US13/961,995
• Publication Number:
  US 20130320098A1
• Time in Patent Office: 488 Days
• Field of Search: 235/492, 343/873
• US Class Current: 235/375
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/44 using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

A wireless IC device includes a base material sheet having a long-side direction and a short-side direction, an antenna element provided on a surface of the base material sheet and that includes two radiation portions extending in the long side direction with a predetermined gap therebetween and two connection portions located in a gap through which the two radiation portions oppose each other, a wireless IC element connected to the two connection portions via a conductive bonding material, and a resist layer that covers the two radiation portions and does not cover the two connection portions and at least areas adjacent to the connection portions in the short-side direction.

Claims

1. A wireless IC device comprising:

a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction;

an antenna element that is provided on a surface of the base material sheet and that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts located in the gap through which the two radiation parts oppose each other;

a wireless IC element that is connected to the two connection parts via a conductive bonding material; and

a resist layer that regulates the movement of the conductive bonding material;

wherein

the resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction; and

wherein the resist layer is completely divided in the long-side direction so as to separately cover the two radiation parts and so as not to cover the two connection parts and entire areas extending from each of the two connection parts to side surfaces of the base material sheet in the short-side direction.

2. The wireless IC device according to claim 1, wherein a maximum length of the conductive bonding material in the short-side direction is larger than a width of each of the connection parts.

3. The wireless IC device according to claim 1, wherein the resist layer is disposed between the two connection parts in such a manner as to extend in the short-side direction.

4. The wireless IC device according to claim 1, wherein a reinforcing member extending along the long-side direction is disposed on each of end portions of the base material sheet facing each other in the short-side direction.

5. The wireless IC device according to claim 4, wherein each of the reinforcing members is made of a material the same as a material out of which the resist layer is made.

6. The wireless IC device according to claim 1, wherein the resist layer is provided on the base material sheet by screen printing.

7. The wireless IC device according to claim 1, wherein the resist layer is provided on the base material sheet by transferring a sheet member onto the base material sheet.

8. The wireless IC device according to claim 1, wherein the length of each of the radiation parts in the short-side direction is larger than the length of a corresponding one of the connection parts in the short-side direction.

9. The wireless IC device according to claim 1, wherein the base material sheet, the antenna element, and the resist layer have flexibility.

10. The wireless IC device according to claim 1, wherein the base material sheet is configured to be attached to an item having flexibility.

11. The wireless IC device according to claim 1, wherein the base material sheet is configured to be attached to a piece of medical gauze.

12. The wireless IC device according to claim 1, wherein the wireless IC element is a wireless IC chip that processes a predetermined radio signal.

13. The wireless IC device according to claim 1, wherein the wireless IC element includes a wireless IC chip that processes a predetermined radio signal and a power supply circuit board that includes a power supply circuit having a predetermined resonant frequency.

14. A method of manufacturing a wireless IC device comprising:

preparing a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction;

forming on a surface of the base material sheet an antenna element that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts formed in the gap through which the two radiation parts oppose each other;

arranging a resist layer in such a manner that the resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction,

wherein the resist layer is completely divided in the long-side direction so as to separately cover the two radiation parts and so as not to cover the two connection parts and entire areas extending from each of the two connection parts to side surfaces of the base material sheet in the short-side direction;

disposing a conductive bonding material on the two connection parts after arranging the resist layer; and

connecting a wireless IC element to the conductive bonding material.

15. The method according to claim 14, further comprising a step of attaching the base material sheet to an item having flexibility.

16. The method according to claim 14, further comprising a step of attaching the base material sheet to a piece of medical gauze.

17. The method according to claim 14, wherein the wireless IC element is a wireless IC chip that processes a predetermined radio signal.

18. The method according to claim 14, wherein the wireless IC element includes a wireless IC chip that processes a predetermined radio signal and a power supply circuit board that includes a power supply circuit having a predetermined resonant frequency.