Method using fluid pressure to remove back metal from semiconductor wafer scribe streets

  • US 8,906,745 B1
  • Filed: 05/09/2014
  • Issued: 12/09/2014
  • Est. Priority Date: 09/12/2013
  • Status: Active Grant
First Claim
Patent Images

1. A method of dividing a semiconductor wafer having a first wafer side including a semiconductor material layer, a second wafer side including a metal layer, and etched scribe streets extending from said first wafer side through said semiconductor material layer to said metal layer between semiconductor material dies, said method comprising the steps of:

  • placing a sheet of deformable material into engagement with the second wafer side to cover said second wafer side;

    positioning said semiconductor wafer with the first wafer side thereof in engagement with a support surface;

    employing said support surface to support said semiconductor wafer; and

    while said sheet of deformable sheet material is in engagement with said second wafer side, carrying out the step of pressurizing fluid contacting said sheet of deformable material to deform the sheet of deformable material and cause the metal layer to break at the locations of the scribe streets.

View all claims

    Thank you for your feedback