Systems and methods for remanufacturing imaging components

• US 8,909,097 B2
• Filed: 12/19/2012
• Issued: 12/09/2014
• Est. Priority Date: 11/14/2012
• Status: Active Grant

• Current Assignee: Apex Semiconductor Incorporated
• Original Assignee: Static Control Components Incorporated (Ninestar Corporation)
• Inventors: Martin, Jonathan W., Huck, Donald R., Novak, Patrick J.
• Primary Examiner(s): Vo, Anh T. N.
• Application Number:
  US13/720,392
• Publication Number:
  US 20140133883A1
• Time in Patent Office: 720 Days
• Field of Search: 399/107, 399/109, 399/110, 399/111, 399/119
• US Class Current: 399/111
• CPC Class Codes: B41J 2/17513 Inner structure
• CPC Class Codes: B41J 2/1752 Mounting within the printer
• CPC Class Codes: B41J 2/17546 electronically
• CPC Class Codes: B41J 2/17553 Outer structure
• CPC Class Codes: B41J 2/17559 Cartridge manufacturing
• CPC Class Codes: G03G 15/0894 Reconditioning of the developer unit, i.e. reusing or recycling parts of the unit, e.g. resealing of the unit before refilling with toner

Abstract

Techniques for modifying an imaging cartridge includes providing the imaging cartridge comprising a body including a circuit holding structure sized to hold an electronic circuit and forming a modified circuit holding structure, with the modified circuit holding structure sized to hold a replacement electronic circuit. At least one dimension of the replacement electronic circuit may be greater than a corresponding dimension of the electronic circuit.

Claims

1. A method of modifying an imaging cartridge comprising the steps of:

providing the imaging cartridge comprising a body including a circuit holding structure sized to hold an electronic circuit;

providing a jig having a cartridge receiving area that is shaped to receive the imaging cartridge and a guide hole;

placing the imaging cartridge in the cartridge receiving area, wherein the circuit holding area is located adjacent the guide hole of the jig;

providing a removal tool for removing a portion of the circuit holding structure; and

guiding the removal tool using guide hole to remove a predetermined amount of material from the circuit holding structure.

2. The method of claim 1 wherein the removal tool is a drill bit having a stop collar and the stop collar engages the guide hole to limit a depth of drilling.

3. The method of claim 1 further comprising the step of attaching a replacement chip in the circuit holding area.

4. The method of claim 3 further comprising placing a flexible thin film member over a portion of the replacement chip and a portion of the circuit holding structure.

5. The method of claim 1 wherein there is a gap formed by removing a portion of the circuit holding area and a portion of the replacement chip covers the gap.

6. The method of claim 1 wherein there is a gap formed by removing a portion of the circuit holding area and the gap is filled with a material.

7. The method of claim 1 wherein there is a gap formed by removing a portion of the circuit holding area and the gap is covered by a flexible thin film member.