Signal processing circuit and antenna apparatus

• US 8,912,906 B2
• Filed: 09/12/2011
• Issued: 12/16/2014
• Est. Priority Date: 03/13/2009
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Taniguchi, Katsumi, Kato, Noboru
• Primary Examiner(s): PHAM, TOAN NGOC
• Application Number:
  US13/229,814
• Publication Number:
  US 20120001701A1
• Time in Patent Office: 1,191 Days
• Field of Search: 340/572.7, 340/572.4, 340/572.5, 340/10.1, 340/10.3, 340/10.4, 333/5
• US Class Current: 340/572.7
• CPC Class Codes: G06K 7/0008 General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• CPC Class Codes: H01Q 11/08 Helical antennas
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/27 Spiral antennas
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

To form a signal processing circuit and an antenna apparatus that do not need a circuit to adjust resonant frequency of a resonant circuit or resonant-frequency adjustment work and that are downsized, an antenna coil and a capacitor define an antenna resonant circuit. An impedance matching circuit including capacitors, a first coil, and a second coil is provided between the antenna resonant circuit and a wireless IC. The first coil and the second coil are magnetically coupled.

Claims

1. An antenna apparatus, comprising:

a wireless IC configured to be used in a wireless IC device to perform wireless communication with external equipment and including a first input/output terminal and a second input/output terminal;

an antenna resonance circuit including an antenna coil configured to transmit and receive a signal by the wireless communication with the external equipment, one end of the antenna coil being connected to the first input/output terminal, and another end of the antenna coil being connected to the second input/output terminal; and

an impedance matching circuit including a portion that is connected between the first and second input/output terminals of the wireless IC and the antenna resonance circuit, the portion of the impedance matching circuit including;

a first coil connected between the first input/output terminal and the one end of the antenna coil; and

a second coil connected between the second input/output terminal and the another end of the antenna coil, and magnetically coupled to the first coil;

wherein

the first and second coils are magnetically coupled to each other such that the first and second coils strengthen a magnetic flux with each other.

2. The antenna apparatus according to claim 1, wherein the first and second two coils are configured to cause signals at the first and second input/output terminals to be approximately 180°

out of phase with each other.

3. The antenna apparatus according to claim 1, wherein the first and second input/output terminals are balanced terminals that output or receive balanced signals, and the first and second coils are connected in series with the balanced terminals.

4. The antenna apparatus according to claim 1, wherein the first and second input/output terminals are balanced terminals that output or receive balanced signals.

5. The antenna apparatus according to claim 1, wherein the first and second coils have an identical coil axis and are aligned in a direction of the coil axis.

6. The antenna apparatus according to claim 1, wherein the first and second coils are located on a plane, and one of the first and second coils is disposed inside the other of the first and second coils.

7. The antenna apparatus according to claim 1, wherein the first and second coils have an identical inductance.

8. The antenna apparatus according to claim 1, wherein the first and second coils are provided on a multilayer substrate comprising a magnetic substance.

9. The antenna apparatus according to claim 8, wherein at least a portion of a circuit electrically connected to the first and second coils is disposed on or within the multilayer substrate.