Thermally conductive printed circuit board bumpers

• US 8,913,390 B2
• Filed: 06/28/2012
• Issued: 12/16/2014
• Est. Priority Date: 06/28/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Malek, Shayan, Wittenberg, Michael B., Christophy, Miguel C.
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US13/536,890
• Publication Number:
  US 20140002996A1
• Time in Patent Office: 901 Days
• Field of Search: 361/679.46, 361/679.54, 361/679.55, 361704-715, 361719-722, 361/816, 361/818, 165/80.2, 165/80.3, 165/104.33, 165/185, 257/706, 257/707, 257/712, 257/714, 257/720, 174/15.1, 174/16.3, 174/252
• US Class Current: 361/714
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.

Claims

1. Apparatus, comprising:

an electrical component;

a printed circuit board to which the electrical component is mounted;

a thermally conductive electronic device housing structure; and

thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure to conduct heat from the electrical component to the thermally conductive electronic device housing structure, wherein the printed circuit board has an edge and wherein the thermally conductive elastomeric structures are interposed between the edge and the thermally conductive electronic device housing structure.

2. The apparatus defined in claim 1 further comprising a metal coating on the edge of the printed circuit board.

3. The apparatus defined in claim 2 wherein the thermally conductive electronic device housing structure comprises a metal housing wall.

4. The apparatus defined in claim 3 wherein the thermally conductive elastomeric structures comprise an elastomeric polymer with a thermally conductive additive.

5. The apparatus defined in claim 4 wherein the elastomeric polymer comprises silicone.

6. The apparatus defined in claim 4 wherein the elastomeric polymer has a Shore A hardness of less than 60.

7. The apparatus defined in claim 4 wherein the thermally conductive elastomeric structures are configured to exhibit a thermal conductivity of greater than 1 W/mK.

8. The apparatus defined in claim 1 wherein the printed circuit board has opposing first and second planar surfaces and has a metal trace on the first planar surface and wherein the thermally conductive elastomeric structures conduct heat from the metal trace to the thermally conductive electronic device housing structure.

10. The apparatus defined in claim 1, wherein the edge has at least one recess, wherein the edge has an edge surface covered with an edge surface metal layer, and wherein the thermally conductive elastomeric structures are configured to conduct heat from the edge surface metal layer to the thermally conductive housing structure.

9. Apparatus, comprising:

an electrical component;

a printed circuit board to which the electrical component is mounted;

a thermally conductive electronic device housing structure; and

thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure to conduct heat from the electrical component to the thermally conductive electronic device housing structure, wherein the thermally conductive elastomeric structures comprise at least one elastomeric member with a C-shaped cross section.

11. An electronic device, comprising:

a printed circuit board that includes metal traces;

an integrated circuit mounted on the printed circuit board that generates heat that is conducted to the metal traces;

a thermally conductive housing structure; and

thermally conductive elastomeric bumper structures that are coupled between the printed circuit board and the thermally conductive housing structure to conduct heat from the metal traces to the thermally conductive housing structure, wherein the thermally conductive housing structure comprises a metal housing wall with an inner surface, wherein the metal traces include ground plane traces, wherein the printed circuit board includes an edge surface coated with a metal layer that contacts at least one of the ground plane traces, and wherein the thermally conductive elastomeric bumper structures contact the metal layer and contact the inner surface of the metal housing wall.

12. The electronic device defined in claim 11 wherein the thermally conductive elastomeric bumper structures comprise an elastomeric member with a C-shaped cross section.

13. The electronic device defined in claim 11 wherein the thermally conductive elastomeric bumper structures comprise thermally conductive silicone.

14. Apparatus, comprising:

an integrated circuit that generates heat;

a printed circuit to which the integrated circuit is mounted;

a metal electronic device housing structure; and

a thermally conductive elastomeric member that physically contacts the printed circuit and that physically contacts the metal electronic device housing member, wherein the printed circuit has opposing upper and lower surfaces and has an edge surface that is perpendicular to the upper and lower surfaces, wherein the printed circuit includes metal traces coupled to a metal layer on the edge surface, and wherein the thermally conductive elastomeric member is configured to conduct heat from the metal layer of the edge surface to the metal electronic device housing structure to cool the electrical component.

15. Apparatus, comprising:

an electrical component;

a printed circuit board to which the electrical component is mounted;

a thermally conductive electronic device housing structure; and

thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure, wherein the thermally conductive elastomeric structures are in contact with more than one surface of the printed circuit board.

16. Apparatus, comprising:

an electrical component;

a printed circuit board to which the electrical component is mounted;

a thermally conductive electronic device housing structure; and

thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure, wherein the thermally conductive elastomeric structures are in contact with more than one surface of the thermally conductive electronic device housing structure.