Method for providing near-hermetically coated integrated circuit assemblies

• US 8,935,848 B1
• Filed: 10/16/2013
• Issued: 01/20/2015
• Est. Priority Date: 08/23/2006
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Boone, Alan P., Lower, Nathan P., Wilcoxon, Ross K.
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US14/055,746
• Time in Patent Office: 461 Days
• Field of Search: 298/30, 298/32, 298/40, 298/46, 438/57, 438/127
• US Class Current: 29/840
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29288 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2224/29387 Ceramics, e.g. crystalline carbides, nitrides or oxides glass ceramics H01L2224/29388
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85206 : Direction of oscillation
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/24 : solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/291 : Oxides or nitrides or carbides, e.g. ceramics, glass
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3171 : the coating being directly applied to the semiconductor body, e.g. passivation layer H01L23/3178 takes precedence
• CPC Class Codes: H01L 23/3731 : Ceramic materials or glass H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H05K 3/0085 : Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly. The method further includes curing the coating. Further, the integrated circuit may be a device which is available for at least one of sale, lease and license to a general public, such as a Commercial off the Shelf (COTS) device. Still further, the coating may promote corrosion resistance and reliability of the integrated circuit assembly.

Claims

1. A method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate, the method comprising:

mounting the integrated circuit to the substrate,

during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly; and

curing the coating.

2. The method of claim 1, wherein the substrate is a chip carrier.

3. The method of claim 1, wherein the localized interconnect interface is a bond wire-bond pad interface, the bond wire-bond pad interface including at least one of a bond wire and a bond pad.

4. The method of claim 1, wherein the glass-based coating is an alkali silicate-based coating.

5. The method of claim 1, wherein the integrated circuit is a Commercial off the Shelf (COTS) device.

6. The method of claim 1, further comprising:

prior to applying the coating, adding nanoparticles to the coating for promoting corrosion resistance of at least one of the assembly and the coating.

7. The method of claim 1, wherein the steps of applying and curing are performed at a temperature at least one of less than 160 degrees Celsius and equal to 160 degrees Celsius.

8. The method of claim 1, wherein the substrate is a printed circuit board.

16. The method of claim 1, wherein the substrate comprises at least one of a ceramic material, a plastic material, and an epoxy material.

17. The method of claim 1, wherein the substrate comprises a plastic material.

19. The method of claim 1, further comprising forming the glass-based coating from an alkali metal oxide and a silicon dioxide.

9. A method for providing an electronic device, the electronic device including an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate, the method comprising:

mounting the integrated circuit to the substrate;

during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly;

curing the coating; and

at least substantially enclosing the integrated circuit assembly within a housing.

10. The method of claim 9, wherein the substrate is a chip carrier.

11. The method of claim 9, wherein the localized interconnect interface is a bond wire-bond pad interface, the bond wire-bond pad interface including at least one of a bond wire and a bond pad.

12. The method of claim 9, wherein the glass-based coating is an alkali silicate-based coating.

13. The method of claim 9, wherein the integrated circuit is a Commercial off the Shelf (COTS) device.

14. The method of claim 9, further comprising:

prior to applying the coating, adding nanoparticles to the coating for promoting corrosion resistance of at least one of the assembly and the coating.

15. The method of claim 9, wherein the steps of application and curing are performed at a temperature at least one of less than 160 degrees Celsius and equal to 160 degrees Celsius.

18. The method of claim 9, wherein the substrate comprises at least one of a ceramic material, a plastic material, and an epoxy material.

20. The method of claim 9, further comprising forming the glass-based coating from an alkali metal oxide and a silicon dioxide.