Image sensor for endoscopic use

• US 8,952,312 B2
• Filed: 05/14/2012
• Issued: 02/10/2015
• Est. Priority Date: 05/12/2011
• Status: Active Grant

• Current Assignee: Depuy Synthes Products Incorporated (Johnson & Johnson)
• Original Assignee: Olive Medical Corporation (Johnson & Johnson)
• Inventors: Blanquart, Laurent, Talbert, Joshua D., Henley, Jeremiah D., Wichern, Donald M.
• Primary Examiner(s): Ko, Tony
• Application Number:
  US13/471,446
• Publication Number:
  US 20120307030A1
• Time in Patent Office: 1,002 Days
• Field of Search: 250/208.1, 257/686, 257/777
• US Class Current: 250/208.1
• CPC Class Codes: A61B 1/00009 of image signals during a use of endoscope
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61B 1/0676 at distal tip of an endoscope
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/146 Imager structures
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14603 Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14638 Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14641 Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14689 MOS based technologies
• CPC Class Codes: H01L 27/1469 : Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/381 : Pitch distance
• CPC Class Codes: H01L 31/028 : including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
• CPC Class Codes: H01L 31/0296 : including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
• CPC Class Codes: H01L 31/0304 : including, apart from doping materials or other impurities, only AIIIBV compounds
• CPC Class Codes: H04N 23/555 : for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/56 : provided with illuminating means
• CPC Class Codes: H04N 25/75 : Circuitry for providing, modifying or processing image signals from the pixel array
• CPC Class Codes: H04N 25/767 : Horizontal readout lines, multiplexers or registers
• CPC Class Codes: H04N 25/772 : comprising A/D, V/T, V/F, I/T or I/F converters
• CPC Class Codes: H04N 25/778 : comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
• CPC Class Codes: H04N 25/79 : Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Abstract

An endoscopic device having embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.

Claims

1. An endoscopic device comprising:

a lumen;

an imaging sensor disposed near the distal tip of said lumen;

wherein said imaging sensor comprises;

a plurality of substrates comprising at least a first substrate and a second substrate;

a pixel array located on the first substrate and comprising a plurality of pixel columns, wherein each of the plurality of pixel columns is defined as one pixel in width and a plurality of pixels in length;

a plurality of supporting circuits located on the second substrate and comprising a plurality of circuit columns, where one circuit column corresponds with one pixel column, wherein each of the plurality of circuit columns is defined as having an area that corresponds with an area of a corresponding pixel column;

a plurality of buses, wherein there is one pixel column bus per at least one pixel column residing on the first substrate and one circuit column bus per circuit column residing on said second substrate;

wherein at least a portion of each of the pixel column buses is superimposed with at least a portion of each of the corresponding circuit column buses and at least one interconnect providing electrical communication between one pixel column bus and one corresponding circuit column bus; and

wherein said at least one interconnect is located anywhere between one pixel column bus and one corresponding circuit column bus and are superimposed with respect to each other.

2. The endoscope of claim 1 further comprising a plurality inter connects disposed between said substrates and wherein said plurality of interconnects are spaced relative to one another at a distance that is greater than a pixel pitch of said pixel array.

3. The endoscope of claim 1, wherein the first substrate and second substrate are in alignment.

4. The endoscope of claim 1, wherein an area of one of said pixel columns on said first substrate is substantially equal to an area of one of said corresponding circuit columns on said second substrate.

5. The endoscope of claim 1, wherein said second substrate is substantially the same size as said first substrate.

6. The endoscope of claim 1, wherein an area of one of said pixel columns on said first substrate is larger than an area of one of said corresponding circuit columns on said second substrate.

7. The endoscope of claim 1, wherein an area of one of said pixel columns on said first substrate is smaller than an area of one of said corresponding circuit columns on said second substrate.

8. The endoscope of claim 1, wherein an aspect ratio of one of said pixel columns is substantially similar to an aspect ratio of one of said circuit columns.

9. The endoscope of claim 1, wherein a plurality of interconnects connect a pixel column bus to a corresponding circuit column bus.

10. The endoscope of claim 1, wherein an aspect ratio of one of said pixel columns is different than an aspect ratio of one of said circuit columns.

11. The endoscope of claim 1, wherein the aspect ratio of one of said circuit columns is four times wider than and one-forth the length of the aspect ratio of one of said pixel columns.

12. The endoscope of claim 8, wherein the aspect ratio of one of said circuit columns is two times wider than and one-half the length of the aspect ratio of one of said pixel columns.

13. An endoscope comprising:

a lumen;

an imaging sensor disposed within said endoscope comprising;

a plurality of substrates comprising a first substrate and at least one second, subsequent supporting substrate;

a pixel array;

a plurality of interconnects; and

a plurality of support circuits;

wherein the first substrate of the plurality of substrates comprises the pixel array;

wherein the plurality of supporting circuits are disposed on the at least one second, subsequent supporting substrate that is disposed remotely relative to said first substrate;

wherein said plurality of supporting circuits are electrically connected to, and in electrical communication with, said pixel array via the plurality of interconnects disposed between said first substrate and said at least one second, subsequent supporting substrate;

wherein said second, subsequent supporting substrate is disposed behind said pixel array relative to an object to be imaged;

wherein said plurality of interconnects are spaced relative to one another at a distance that is greater than a pixel pitch of said pixel array.

14. The endoscope of claim 13, wherein said pixel array located on the first substrate comprises a plurality of pixel columns, wherein each of the plurality of pixel columns is defined as one pixel in width and a plurality of pixels in length.

15. The endoscope of claim 14, further comprising a plurality of supporting circuits located on the second substrate and comprising a plurality of circuit columns, where one circuit column corresponds with one pixel column, wherein each of the plurality of circuit columns is defined as having an area that corresponds with an area of a corresponding pixel column.

16. The endoscope of claim 14, further comprising a plurality of buses, wherein there is one pixel column bus per at least one pixel column residing on the first substrate and one circuit column bus per circuit column residing on said second substrate.

17. The endoscope of claim 16, wherein at least a portion of each of the pixel column buses is superimposed with at least a portion of each of the corresponding circuit column buses and at least one interconnect providing electrical communication between one pixel column bus and one corresponding circuit column bus;

and

wherein said at least one interconnect is located anywhere between one pixel column bus and one corresponding circuit column bus and are superimposed with respect to each other.

18. The endoscope of claim 13, wherein said imaging sensor is backside illuminated.

19. The imaging sensor of claim 13, wherein said pixel array covers a substantial majority of a surface of said first substrate.

20. The imaging sensor of claim 13, wherein said pixel array covers more than twenty-five percent of a surface of said first substrate.

21. The imaging sensor of claim 13, wherein said first substrate is made of primarily silicon material.

22. The imaging sensor of claim 13, wherein said first substrate is made of primarily of “

High-Z”

semiconductor material (Cadmium Telluride).

23. The imaging sensor of claim 13, wherein said first substrate is made primarily of III-V semiconductor materials (Gallium Arsenide).

24. The imaging sensor of claim 23, wherein the pixel array is comprised of a plurality of pixel columns, wherein each pixel column comprises a plurality of pixels;

wherein each of the plurality of pixel columns within the pixel array is read to a bus, starting from a first column that is read from a common origin, wherein a second column is read from a first row that is different from the pixel column that was previously read with respect to the second column and different from the pixel column that is read subsequent with respect to the second column.

25. The imaging sensor of claim 24, wherein said first row is spaced at least two row positions away from the row position of the previously read pixel column and the subsequently read pixel column.

26. An endoscopic device comprising:

a lumen;

an imaging sensor disposed near the distal tip of said lumen;

wherein said imaging sensor comprises;

a plurality of substrates comprising at least a first substrate and a second substrate;

a pixel array located on the first substrate and comprising a plurality of pixel columns, wherein each of the plurality of pixel columns is defined as one pixel in width and a plurality of pixels in length enough to cover the dimension of the array;

wherein said pixel columns are divided into pixel sub-columns such that each pixel sub-column is electrically isolated from other pixel sub-columns;

a plurality of supporting circuits located on the second substrate and comprising a plurality of circuit columns, where one circuit column corresponds with one pixel sub-column, wherein each of the plurality of circuit columns is defined as having an area that corresponds with an area of a corresponding pixel sub-column;

a plurality of buses, wherein there is one pixel sub-column bus per at least one pixel sub-column residing on the first substrate and one circuit column bus per circuit column residing on said second substrate;

wherein at least a portion of each of the pixel sub-column buses is superimposed with at least a portion of each of the corresponding circuit column buses and at least one interconnect providing electrical communication between one pixel sub-column bus and one corresponding circuit column bus; and

wherein said at least one interconnect is located anywhere between one pixel sub-column bus and one corresponding circuit column bus and are superimposed with respect to each other.

27. The endoscope of claim 26 further comprising a plurality inter connects disposed between said substrates and wherein said plurality of interconnects are spaced relative to one another at a distance that is greater than a pixel pitch of said pixel array.

28. The endoscope of claim 26, wherein the first substrate and second substrate are in alignment.

29. The endoscope of claim 26, wherein an area of one of said pixel sub-columns on said first substrate is substantially equal to an area of one of said corresponding circuit columns on said second substrate.

30. The endoscope of claim 26, wherein said second substrate is substantially the same size as said first substrate.

31. The endoscope of claim 26, wherein an area of one of said pixel sub-columns on said first substrate is larger than an area of one of said corresponding circuit columns on said second substrate.

32. The endoscope of claim 26, wherein an area of one of said pixel sub-columns on said first substrate is smaller than an area of one of said corresponding circuit columns on said second substrate.

33. The endoscope of claim 26, wherein an aspect ratio of one of said pixel sub-columns is substantially similar to an aspect ratio of one of said circuit columns.

34. The endoscope of claim 26, wherein a plurality of interconnects connect a pixel sub-column bus to a corresponding circuit column bus.

35. The endoscope of claim 26, wherein an aspect ratio of one of said pixel sub-columns is different than an aspect ratio of one of said circuit columns.

36. The endoscope of claim 26, wherein the aspect ratio of one of said circuit columns is four times wider than and one-forth the length of the aspect ratio of one of said pixel sub-columns.

37. The endoscope of claim 26, wherein the aspect ratio of one of said circuit columns is two times wider than and one-half the length of the aspect ratio of one of said pixel sub-columns.