Layered bandpass filter

• US 8,952,767 B2
• Filed: 03/26/2012
• Issued: 02/10/2015
• Est. Priority Date: 03/30/2011
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Wakata, Eiko, Tomaki, Shigemitsu, Abe, Isao
• Primary Examiner(s): Lee, Benny
• Assistant Examiner(s): PATEL, RAKESH BHASKARBHAI
• Application Number:
  US13/429,982
• Publication Number:
  US 20120249264A1
• Time in Patent Office: 1,051 Days
• Field of Search: 333/175, 333/185
• US Class Current: 333/185
• CPC Class Codes: H01P 1/20345 Multilayer filters
• CPC Class Codes: H03H 2001/0085 Multilayer, e.g. LTCC, HTCC, green sheets inside PCB filters H05K
• CPC Class Codes: H03H 7/12 Bandpass or bandstop filters with adjustable bandwidth and fixed centre frequency H03H7/09 takes precedence; automatic control of bandwidth in amplifiers H03G5/16

Abstract

A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.

Claims

1. A layered bandpass filter comprising:

a layered structure including a plurality of dielectric layers that are stacked;

an input terminal and an output terminal disposed on a periphery of the layered structure; and

a first resonator, a second resonator, and a third resonator provided within the layered structure, wherein;

of the first to third resonators, the first resonator is located closest to the input terminal, the third resonator is located closest to the output terminal, and the second resonator is located between the first resonator and the third resonator, in terms of circuit configuration;

the first resonator includes a first inductor and a first capacitor;

the second resonator includes a second inductor and a second capacitor;

the third resonator includes a third inductor and a third capacitor;

the second inductor is disposed at a position different from that of each of the first and third inductors in a stacking direction of the plurality of dielectric layers;

no conductor layer is present between the second inductor and the first inductor and between the second inductor and the third inductor;

the second inductor includes a first portion, a second portion, and a third portion;

the first portion is elongated in one direction;

the second portion and the third portion are connected to a same longitudinal end of the first portion;

part of the second portion is opposed to part of the first inductor;

part of the third portion is opposed to part of the third inductor;

the first to third capacitors are disposed at positions different from those of the first to third inductors in the stacking direction;

the second inductor is lower in inductance than the first and third inductors; and

the second capacitor is higher in capacitance than the first and third capacitors.

2. The layered bandpass filter according to claim 1, wherein the first and third inductors are disposed on a same one of the plurality of dielectric layers.

3. The layered bandpass filter according to claim 1, further comprising a ground terminal disposed on an end face of the layered structure in the stacking direction, and a common conductive path for electrically connecting the first to third inductors to the ground terminal, wherein the first portion of the second inductor is connected to the common conductive path.

4. The layered bandpass filter according to claim 3, wherein the common conductive path is formed using through holes.

5. The layered bandpass filter according to claim 3, wherein the common conductive path is formed using a conductor layer disposed on the periphery of the layered structure.

6. A layered bandpass filter comprising:

a layered structure including a plurality of dielectric layers that are stacked;

an input terminal and an output terminal disposed on a periphery of the layered structure; and

a first resonator, a second resonator, and a third resonator provided within the layered structure, wherein;

of the first to third resonators, the first resonator is located closest to the input terminal, the third resonator is located closest to the output terminal, and the second resonator is located between the first resonator and the third resonator, in terms of circuit configuration;

the first resonator includes a first inductor and a first capacitor;

the second resonator includes a second inductor and a second capacitor;

the third resonator includes a third inductor and a third capacitor;

the second inductor is disposed at a position different from that of each of the first and third inductors in a stacking direction of the plurality of dielectric layers;

no conductor layer is present between the second inductor and the first inductor and between the second inductor and the third inductor;

the first to third capacitors are disposed at positions different from those of the first to third inductors in the stacking direction;

the second inductor is lower in inductance than the first and third inductors;

the second capacitor is higher in capacitance than the first and third capacitors; and

the second capacitor is formed using three or more conductor layers that are disposed at different positions in the stacking direction.

7. A layered bandpass filter comprising:

a layered structure including a plurality of dielectric layers that are stacked;

an input terminal and an output terminal disposed on a periphery of the layered structure; and

a first resonator, a second resonator, and a third resonator provided within the layered structure, wherein;

of the first to third resonators, the first resonator is located closest to the input terminal, the third resonator is located closest to the output terminal, and the second resonator is located between the first resonator and the third resonator, in terms of circuit configuration;

the first resonator includes a first inductor and a first capacitor;

the second resonator includes a second inductor and a second capacitor;

the third resonator includes a third inductor and a third capacitor;

the second inductor is disposed at a position different from that of each of the first and third inductors in a stacking direction of the plurality of dielectric layers;

no conductor layer is present between the second inductor and the first inductor and between the second inductor and the third inductor;

the first to third capacitors are disposed at positions different from those of the first to third inductors in the stacking direction;

the second inductor is lower in inductance than the first and third inductors;

the second capacitor is higher in capacitance than the first and third capacitors; and

the second resonator further includes a fourth inductor connected to the second capacitor in series.