Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first conductive layer;
a first insulating film over the first conductive layer;
a circuit portion over the first insulating film, the circuit portion comprising a transistor;
a second insulating film over the circuit portion; and
a second conductive layer over the second insulating film,wherein the first insulating film is in contact with the second insulating film at a periphery of the circuit portion,wherein each of the first conductive layer and the second conductive layer comprises one of titanium and a compound of silicon oxide and indium tin oxide, andwherein the first conductive layer is electrically connected to the second conductive layer at side surfaces of the first insulating film and the second insulating film.
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Accused Products
Abstract
A semiconductor device in which defects in characteristics due to electrostatic discharge is reduced and a method for manufacturing the semiconductor device are provided. The semiconductor device has at least one of these structures: (1) a structure in which a first and second insulating films are in direct contact with each other in a peripheral region of a circuit portion, (2) a structure in which a first and second insulators are closely attached to each other, and (3) a structure in which a first conductive layer and a second conductive layer are provided on outer surfaces of the first insulator and the second insulator, respectively, and electrical conduction between the first and second conductive layers is achieved at a side surface of the peripheral region. Note that the conduction at the side surface can be achieved by cutting a plurality of semiconductor devices into separate semiconductor devices.
85 Citations
9 Claims
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1. A semiconductor device comprising:
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a first conductive layer; a first insulating film over the first conductive layer; a circuit portion over the first insulating film, the circuit portion comprising a transistor; a second insulating film over the circuit portion; and a second conductive layer over the second insulating film, wherein the first insulating film is in contact with the second insulating film at a periphery of the circuit portion, wherein each of the first conductive layer and the second conductive layer comprises one of titanium and a compound of silicon oxide and indium tin oxide, and wherein the first conductive layer is electrically connected to the second conductive layer at side surfaces of the first insulating film and the second insulating film. - View Dependent Claims (2, 3)
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4. A semiconductor device comprising:
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a first conductive layer; a first insulating film over the first conductive layer; a circuit portion over the first insulating film, the circuit portion comprising a transistor; a third insulating film over the circuit portion; a fourth insulating film over the third insulating film; a second insulating film over the fourth insulating film; and a second conductive layer over the second insulating film, wherein the first insulating film is in contact with the second insulating film at a periphery of the circuit portion, wherein each of the first conductive layer and the second conductive layer comprises one of titanium and a compound of silicon oxide and indium tin oxide, wherein the third insulating film is in contact with the fourth insulating film at the periphery of the circuit portion, and wherein the first conductive layer is electrically connected to the second conductive layer at side surfaces of the first insulating film and the second insulating film. - View Dependent Claims (5, 6)
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7. A semiconductor device comprising:
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a first conductive layer; a first insulating film over the first conductive layer; a circuit portion over the first insulating film, the circuit portion comprising a transistor; a third insulating film over the circuit portion; a fourth insulating film over the third insulating film; a second insulating film over the fourth insulating film; and a second conductive layer over the second insulating film, wherein the first insulating film is in contact with the second insulating film at a periphery of the circuit portion, wherein each of the first conductive layer and the second conductive layer comprises one of titanium and a compound of silicon oxide and indium tin oxide, wherein the third insulating film is in contact with the fourth insulating film at the periphery of the circuit portion, wherein the circuit portion overlaps with the first conductive layer and the second conductive layer, wherein the first conductive layer is electrically connected to the second conductive layer at side surfaces of the first insulating film and the second insulating film. - View Dependent Claims (8, 9)
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Specification