Semiconductor device and method of manufacturing the same
First Claim
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1. A semiconductor device comprising:
- a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on an other side;
an electrically conductive frame provided on a side periphery of the chip;
a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip; and
an insulation side portion provided between the electrically conductive frame and the side periphery of the chip,wherein an electrical connection from the one side to the second chip electrode is enabled via the electrically conductive frame and the rewiring.
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Abstract
According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other side, an electrically conductive frame provided on a side periphery of the chip, a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip, and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip.
8 Citations
12 Claims
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1. A semiconductor device comprising:
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a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on an other side; an electrically conductive frame provided on a side periphery of the chip; a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip; and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip, wherein an electrical connection from the one side to the second chip electrode is enabled via the electrically conductive frame and the rewiring. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on an other side; an electrically conductive frame provided on a side periphery of the chip; a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip; an insulation side portion provided between the electrically conductive frame and the side periphery of the chip; a first rewiring electrode which is electrically connected to the first chip electrode on the one side of the chip and constitutes a first external electrode; a second rewiring electrode which is electrically connected to the electrically conductive frame on the one side of the chip and constitutes a second external electrode; and an electrode insulation portion configured to mutually insulate a plurality of said rewiring electrodes on the one side of the chip, wherein an electrical connection to the first chip electrode is enabled from the one side via the first rewiring electrode, and an electrical connection to the second chip electrode is enabled from the one side via the second rewiring electrode, the electrically conductive frame and the rewiring. - View Dependent Claims (8, 9)
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10. A semiconductor device comprising:
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a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on an other side; an electrically conductive frame provided on a side periphery of the chip; a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip; and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip, wherein the semiconductor device is configured as a semiconductor package device, a third chip electrode is formed on the first surface of the chip, the semiconductor package device includes a rewiring electrode which is electrically connected to the third chip electrode on the one side of the chip and constitutes an external electrode, each of the first to third chip electrodes is any one of a source, a gate and a drain, and an electrical connection to the first to third chip electrodes is enabled from the one side. - View Dependent Claims (11)
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12. A semiconductor device comprising:
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a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on an other side; an electrically conductive frame provided on a side periphery of the chip; a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip; and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip, wherein an electrically conductor member, which is electrically connected to the second chip electrode, is provided on the second surface on the other side of the chip, the rewiring is formed on a surface on an other side of the electrically conductive member, and the electrically conductive frame and the rewiring are electrically connected via the electrically conductive member.
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Specification