Radio frequency interconnect circuits and techniques

• US 8,981,869 B2
• Filed: 01/27/2010
• Issued: 03/17/2015
• Est. Priority Date: 09/21/2006
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Puzella, Angelo M., Crowder, Joseph M., Dupuis, Patricia S., Fallica, Michael C., Francis, John B., Licciardello, Joseph A.
• Primary Examiner(s): Jones, Stephen E
• Application Number:
  US12/694,450
• Publication Number:
  US 20100126010A1
• Time in Patent Office: 1,875 Days
• Field of Search: 333/32, 333/33, 333/238, 333/246, 333/260
• US Class Current: 333/33
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09145 Edge details
• CPC Class Codes: H05K 2201/09454 Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/09718 Clearance holes
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Claims

1. A method of manufacturing a multilayer printed circuit board assembly provided from a plurality of printed circuit boards, the method comprising the unordered steps of:

bonding together a plurality of printed circuit boards to form a bonded printed circuit board assembly having first and second opposing outer surfaces with at least a first one of the plurality of printed circuit boards having a first circuit on a layer thereof and at least a second different one of the plurality of printed circuit boards having a second circuit on a layer thereof;

drilling a plurality of holes which extend through the first and second opposing outer surfaces of the bonded printed circuit board assembly with one of the holes intersecting both the first and second circuits in the bonded printed circuit board assembly;

plating each of the plurality of holes to form a plurality of conductive via holes and wherein the conductive via hole which intersects both the first and second circuits corresponds to an RF interconnect between the first and second circuits and wherein the RF interconnect has at least one stub portion; and

forming an RF matching pad on at least one layer of at least one of said plurality of printed circuit boards such that the RF matching pad is electrically coupled to the RF interconnect so as to adjust an impedance characteristic of the RF interconnect; and

wherein forming an RF matching pad comprises forming a disk-shaped RF matching pad by providing a conductor having a disk shape on the at least one layer of at least one of said plurality of printed circuit boards, such that the disk-shaped conductor is electrically coupled to the RF interconnect and wherein the size of the disk-shaped conductor is selected to adjust an impedance characteristic of the RF interconnect.

2. The method of claim 1 further comprising plating at least some of the plurality of holes to provide one or more mode suppression vias in the plurality of circuit boards to electrically isolate the RF interconnects from surrounding circuitry.

3. The method of claim 1 wherein first ones of the plurality of conductive via holes correspond to RF interconnects with each of the RF interconnects coupled between a circuit on a layer of one of the plurality of printed circuit boards and a circuit on a layer of a different one of the plurality of printed circuit boards and wherein each of the RF interconnects have at least one stub portion.

4. The method of claim 1, wherein providing a disk-shaped RF matching pad comprises providing a relief area in a ground plane around said RF interconnect to electrically isolate the RF interconnect from the ground plane and wherein the size and shape of the relief area are selected to adjust an impedance characteristic of the RF interconnect.

5. The method of claim 4, wherein providing a relief area in a ground plane comprises providing the relief area having an annular ring shape.

6. A method of manufacturing a multi-layer circuit board assembly provided from a plurality of printed circuit boards, the method comprising:

providing a first circuit on a first layer of a first one of the plurality of printed circuit boards which comprise the multi-layer circuit board assembly;

providing a first circuit on a first layer of a second, different one of the plurality of printed circuit boards which comprise the multi-layer circuit board assembly;

providing an RF matching pad on at least one of;

the first circuit on the first layer of the first one of the plurality of printed circuit boards;

or the first circuit on the first layer of the second, different one of the plurality of printed circuit boards;

joining each of the plurality of printed circuit boards to provide a joined printed circuit board assembly;

drilling a plurality of via holes through the joined printed circuit board assembly with at least one of the plurality of via holes intersecting a portion of the first circuit on the first layer of the first one of the plurality of printed circuit boards and a portion of the first circuit on the first layer of the second one of the plurality of printed circuit boards; and

plating each of the plurality of via holes wherein at least one of the plurality of via holes which intersects a portion of the first circuit on the first layer of the first one of the plurality of printed circuit boards and a portion of the first circuit on the first layer of the second one of the plurality of printed circuit boards forms an RF signal path between the first circuit on the first layer of the first circuit board and the first circuit on the first layer of the second different circuit board and wherein the RF matching pad adjusts an impedance characteristic of the RF signal path to which it is electrically coupled and wherein plating each the plurality of via holes to form the RF signal path between the first circuit on the first layer of the first circuit board and the first circuit on the first layer of the second different circuit board includes forming the RF signal path with an RF stub and wherein providing an RF matching pad comprises providing a conductor having a disk shape on the at least one of;

the first circuit on the first layer of the first one of the plurality of printed circuit boards;

or the first circuit on the first layer of the second, different one of the plurality of printed circuit boards and wherein a size of the disk-shaped RF matching pad adjusts an impedance characteristic of the RF signal path with the RF stub.

7. The method of claim 6 wherein providing circuits on at least some of the plurality of printed circuit boards which comprise the multi-layer circuit board assembly comprises, etching one or more conductors on at least one layer of the at least some of the plurality of printed circuit boards wherein the one or more conductors correspond to radio frequency (RF) transmission lines.

8. The method of claim 6 wherein plating each the plurality of via holes includes plating via holes to form one or more mode suppression via holes in the multilayer circuit board assembly wherein the one or more mode suppression via holes extend from a top-most layer to a bottom-most layer of the multilayer circuit board assembly.

9. The method of claim 6 wherein providing an RF matching pad comprises providing at least one RF matching pad on at least some of the layers of the multilayer circuit board such that each RF matching pad adjusts an impedance characteristic of an RF signal path.

10. The method of claim 9 wherein joining each of the plurality of printed circuit boards comprises bonding together the plurality of printed circuit boards to provide the joined circuit board assembly as a bonded circuit board assembly.

11. The method of claim 6, wherein providing an RF matching pad comprises providing a relief area in a ground plane around a via hole to electrically isolate an RF signal path from a ground plane and wherein the size and shape of the relief area are selected to adjust an impedance characteristic of the RF signal path.

12. The method of claim 11, wherein providing the relief area in the ground plane around the via hole comprises providing a relief area having an annular ring shape.

13. A method of manufacturing a multi-layer circuit board assembly provided from a plurality of printed circuit boards and having at least one electrical signal path between a first circuit on a first layer of the multi-layer circuit board assembly and a first circuit on a second, different layer of the multi-layer circuit board assembly, the method comprising:

bonding each of the plurality of printed circuit boards to provide a bonded multi-layer circuit board assembly such that the bonded multi-layer circuit board assembly is provided having a top-most layer corresponding to the top most layer of the multi-layer circuit board assembly and a bottom-most layer corresponding to the bottom most layer of the multi-layer circuit board assembly and wherein at least some layers of the bonded multi-layer circuit board assembly have one or more RF matching pads provided thereon;

drilling a plurality of via holes through the bonded multi-layer circuit board assembly such that each of the plurality of via holes extend through both the top-most and bottom-most layers of the bonded multi-layer circuit board assembly and wherein at least one of the plurality of via holes intersects a portion of a first circuit on a first layer of a first one of the plurality of printed circuit boards and a portion of a first circuit on a first layer of a second, different one of the plurality of printed circuit boards; and

plating each the plurality of via holes such that at least one of the plurality of via holes which intersects a portion of the first circuit on the first layer of the first one of the plurality of printed circuit boards and a portion of the first circuit on the first layer of the second one of the plurality of printed circuit boards forms an RF signal path between the first circuit on the first layer of the first circuit board and the first circuit on the first layer of the second different circuit board wherein the one or more RF matching pads adjust an impedance characteristic of one or more RF signal paths and wherein plating each the plurality of via holes to form the RF signal path between the first circuit on the first layer of the first circuit board and the first circuit on the first layer of the second different circuit board includes forming the RF signal path with an RF stub and wherein providing an RF matching pad comprises providing a conductor having a disk shape on the at least one of;

the first circuit on the first layer of the first one of the plurality of printed circuit boards;

or the first circuit on the first layer of the second, different one of the plurality of printed circuit boards and wherein a size and shape of the disk-shaped RF matching pad adjusts an impedance characteristic of the RF signal path with the RF stub.

14. The method of claim 13, wherein providing an RF matching pad comprises providing a relief area in a ground plane around a via hole to electrically isolate an RF signal path from a ground plane and wherein the size and shape of the relief area are selected to adjust an impedance characteristic of the RF signal path.

15. The method of claim 14, wherein providing the relief area in the ground plane around the via hole comprises providing a relief area having an annular ring shape.

16. The method of claim 15 wherein plating each of the plurality of via holes includes plating via holes to form one or more mode suppression via holes in the multilayer circuit board assembly wherein the one or more mode suppression via holes extend from a top-most layer to a bottom-most layer of the multilayer circuit board assembly.