Proximity sensor arrangement having a cold mirror in a mobile device
First Claim
1. An electronic device comprising:
- a radiation passing layer having a top surface and a bottom surface;
a proximity sensor having a radiation emitter and a radiation detector, both positioned below the radiation passing layer;
a visibly opaque layer covering the bottom surface of the radiation passing layer except for an opening that allows radiation from the emitter to pass, and scattered radiation to pass to the detector;
a radiation shield positioned between the emitter and the detector, and extending to the bottom surface of the radiation passing layer;
a cold mirror positioned between the shield and the bottom surface of the radiation passing layer, covering said opening in the visibly opaque layer; and
a radiation absorber being a separate piece and of a different material than the shield and positioned to provide a radiation seal between a top surface of the shield and a bottom surface of the cold mirror.
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Accused Products
Abstract
A radiation passing layer has a top surface and a bottom surface below which a proximity sensor is positioned. A visible light opaque layer covers the bottom surface of the radiation passing layer except for an opening therein that allows radiation from the emitter to pass, and scattered radiation to pass to the detector. A radiation shield is between the emitter and the detector, and extends to the bottom of the radiation passing layer. A cold mirror is between the shield and the bottom surface of the radiation passing layer, covering the opening in the opaque layer. A radiation absorber being a separate piece and a different material than the shield provides a radiation seal between the top surface of the shield and the bottom surface of the cold mirror. Other embodiments are also described and claimed.
31 Citations
25 Claims
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1. An electronic device comprising:
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a radiation passing layer having a top surface and a bottom surface; a proximity sensor having a radiation emitter and a radiation detector, both positioned below the radiation passing layer; a visibly opaque layer covering the bottom surface of the radiation passing layer except for an opening that allows radiation from the emitter to pass, and scattered radiation to pass to the detector; a radiation shield positioned between the emitter and the detector, and extending to the bottom surface of the radiation passing layer; a cold mirror positioned between the shield and the bottom surface of the radiation passing layer, covering said opening in the visibly opaque layer; and a radiation absorber being a separate piece and of a different material than the shield and positioned to provide a radiation seal between a top surface of the shield and a bottom surface of the cold mirror. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An electronic device comprising:
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a wireless telephony handset housing having an infrared light passing cover whose top face is part of an exterior face of the housing and whose bottom face is inside the housing; a proximity sensor having an infrared emitter and an infrared detector both positioned below the bottom face of the cover, inside the housing; a visible light opaque layer covering the bottom surface of the cover except for an opening that allows infrared radiation from the emitter to pass, and scattered infrared radiation to pass to the detector; an internal frame member positioned between the emitter and the detector, the frame member to block infrared radiation between the emitter and the detector; a cold mirror positioned between the internal frame member and the bottom surface of the cover, covering said opening in the opaque layer; and an infrared absorber formed between a top surface of the frame member and a bottom surface of the cold mirror. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. The electronic device 20 wherein the absorber is in contact with the bottom surface of the cold mirror and has two holes formed therein aligned with the emitter and the detector, respectively.
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22. A method for manufacturing an electronic device, comprising:
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applying an infrared absorber to a cold mirror, wherein the cold mirror covers an opening in a visible light opaque layer that has been applied to a cover, the absorber having the following characteristics in an infrared band 700 nm to 1100 nm, namely transmittance less than 5% and reflectance less than 10%; and
thenpositioning the cover into an exterior housing of a mobile device and fixing the cover in place while the absorber is in contact with a top surface of an internal frame member in the housing that lies between an infrared emitter and an infrared detector of a proximity sensor in the housing, the opening being aligned with a radiation passage for the emitter and the detector. - View Dependent Claims (23)
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24. A method for manufacturing an electronic device, comprising:
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applying an infrared absorber to a cold mirror, wherein the cold mirror covers an opening in a visible light opaque layer that has been applied to a cover; and
thenpositioning the cover into an exterior housing of a mobile device and fixing the cover in place while the absorber is in contact with a top surface of an internal frame member in the housing that lies between an infrared emitter and an infrared detector of a proximity sensor in the housing, the opening being aligned with a radiation passage for the emitter and the detector, the infrared absorber being a separate piece and of a different material than the internal frame and positioned to provide a radiation seal between a top surface of the internal frame and a bottom surface of the cold mirror. - View Dependent Claims (25)
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Specification