Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
First Claim
1. An identification device, comprising:
- a) printed integrated circuitry on a first substrate, the printed integrated circuitry comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film and at least one of the lowest layer and the first and second successive layers is a printed thin film;
b) first and second pads on the first substrate and/or the printed integrated circuitry, the first and second pads electrically connected to the printed integrated circuitry, at first and second locations, respectively; and
c) a single-layer antenna and/or inductor on a second substrate consisting essentially of a conductive line having a first and second ends thereon, the first and second ends being physically connected to the first and second pads, respectively.
6 Assignments
0 Petitions
Accused Products
Abstract
Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor. The present invention advantageously provides a low cost RFID tag capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional RFID tags that manufacture all active electrical devices on a conventional wafer.
28 Citations
36 Claims
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1. An identification device, comprising:
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a) printed integrated circuitry on a first substrate, the printed integrated circuitry comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film and at least one of the lowest layer and the first and second successive layers is a printed thin film; b) first and second pads on the first substrate and/or the printed integrated circuitry, the first and second pads electrically connected to the printed integrated circuitry, at first and second locations, respectively; and c) a single-layer antenna and/or inductor on a second substrate consisting essentially of a conductive line having a first and second ends thereon, the first and second ends being physically connected to the first and second pads, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 34, 35, 36)
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10. A method of manufacturing an identification device, comprising:
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a) forming printed integrated circuitry on a first substrate, the printed integrated circuitry comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film and forming the printed integrated circuit comprises printing at least one of the lowest layer and the first and second successive layers; b) forming first and second pads electrically connected to the printed integrated circuitry at first and second locations, respectively; c) forming a single-layer antenna and/or inductor consisting essentially of a conductive line having first and second ends on a second substrate; and d) physically connecting the first and second pads to the first and second ends of the single-layer antenna and/or inductor, respectively. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing radio frequency identification devices, comprising:
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a) forming a plurality of printed integrated circuits on a first substrate stock to form a printed integrated circuit (PIC) stock, the printed integrated circuit stock comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film, and forming the plurality of printed integrated circuits comprises printing at least one of the lowest layer and the first and second successive layers; b) forming a plurality of single-layer antennas and/or inductors on a second substrate stock to form an antenna stock, each of the plurality of single-layer antennas and/or inductors having first and second opposed ends; and c) attaching the PIC stock to the antenna stock, each of the plurality of PICs being physically connected at first and second locations to the first and second ends of a corresponding one of the plurality of single-layer antennas, respectively. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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Specification