Resin composition and uses of the same

• US 9,006,377 B2
• Filed: 01/13/2012
• Issued: 04/14/2015
• Est. Priority Date: 11/15/2011
• Status: Active Grant

• Current Assignee: Taiwan Union Technology Corporation
• Original Assignee: Taiwan Union Technology Corporation
• Inventors: Wu, Hsin-Ho
• Primary Examiner(s): Shosho, Callie
• Assistant Examiner(s): FREEMAN, JOHN D
• Application Number:
  US13/349,600
• Publication Number:
  US 20130122308A1
• Time in Patent Office: 1,187 Days
• Field of Search: 428/413, 428/418, 528/167, 528/168, 528/398, 528/399, 528/407, 528/423
• US Class Current: 528/168
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 17/04 bonded with or embedded in a plastic substance
• CPC Class Codes: B32B 2250/05 5 or more layers
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2260/023 Two or more layers
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/101 Glass fibres
• CPC Class Codes: B32B 2307/204 Di-electric
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2307/3065 Flame resistant or retardant, fire resistant or retardant
• CPC Class Codes: B32B 2307/558 Impact strength, toughness
• CPC Class Codes: B32B 2307/734 Dimensional stability
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 5/26 another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: B32B 5/28 impregnated with or embedded in a plastic substance not used
• CPC Class Codes: C08G 59/08 from phenol-aldehyde condensates
• CPC Class Codes: C08G 59/4071 phosphorus containing compounds
• CPC Class Codes: C08G 59/5046 heterocyclic
• CPC Class Codes: C08J 2363/04 Epoxynovolacs
• CPC Class Codes: C08J 5/244 : using glass fibres
• CPC Class Codes: C08J 5/249 : characterised by the additives used in the prepolymer mixture
• CPC Class Codes: C08K 5/357 : Six-membered rings
• CPC Class Codes: C08K 5/5313 : Phosphinic compounds, e.g. R2=P(:O)OR'
• CPC Class Codes: C08L 63/04 : Epoxynovolacs
• CPC Class Codes: Y10T 428/31511 : Of epoxy ether
• CPC Class Codes: Y10T 428/31529 : Next to metal

Abstract

A resin composition is provided. The resin composition comprises:

• • an epoxy resin; and
  • a hardener, which is a stable solution obtainable from the following steps:
• (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution:

wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification;

• (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and
• (c) cooling the polymer solution to obtain the stable solution,
  wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.

Claims

1. A resin composition, comprising:

an epoxy resin; and

a hardener which is a stable solution obtainable from the following steps;

(a) adding an N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution;

2. The resin composition of claim 1, wherein the amount of the DOPO-based compound is about 10 wt % to about 40 wt % based on the total weight of the N,O-heterocyclic compound and the DOPO-based compound.

3. The resin composition of claim 2, wherein the N,O heterocyclic compound is

4. The resin composition of claim 2, wherein the organic solvent is selected from the group consisting of cyclohexanone, acetone, butanone, methyl isobutyl ketone, N,N-dimethyl formamide (DMF), N,N-dimethyl acetamide (DMAc), N-methyl-pyrolidone (NMP) and combinations thereof.

5. The resin composition of claim 2, wherein the amount of the hardener is about 70 parts by weight to about 120 parts by weight per 100 parts by weight of the epoxy resin.

6. The resin composition of claim 1, wherein each of m and n is independently 2 or 3 and each of W1 and W2 is independently selected from the group consisting of

7. The resin composition on of claim 6, wherein the N,O heterocyclic compound is

8. The resin composition of claim 6, wherein the organic solvent is selected from the group consisting of cyclohexanone, acetone, butanone, methyl isobutyl ketone, N,N-dimethyl formamide (DMF), N,N-dimethyl acetamide (DMAc), N-methyl-pyrolidone (NMP) and combinations thereof.

9. The resin composition of claim 1, wherein the DOPO-based compound is selected from the group consisting of

10. The resin composition of claim 9, wherein the N,O heterocyclic

compound is

11. The resin composition of claim 9, wherein the organic solvent is selected from the group consisting of cyclohexanone, acetone, butanone, methyl isobutyl ketone, N,N-dimethyl formamide (DMF), N,N-dimethyl acetamide (DMAc), N-methyl-pyrolidone (NMP) and combinations thereof.

12. The resin composition of claim 1, wherein the N,O heterocyclic

compound is

13. The resin composition of claim 1, wherein the organic solvent is selected from the group consisting of cyclohexanone, acetone, butanone, methyl isobutyl ketone, N,N-dimethyl formamide (DMF), N,N-dimethyl acetamide (DMAc), N-methyl-pyrolidone (NMP) and combinations thereof.

14. The resin composition of claim 1, wherein the amount of the hardener is about 70 parts by weight to about 120 parts by weight per 100 parts by weight of the epoxy resin.

15. The resin composition of claim 1, wherein the hardener further comprises dicyandiamide (Dicy), 4,4′

-diaminodiphenyl sulfone (DDS), or Novolac.

16. The resin composition of claim 1, which further comprises an additive selected from the group consisting of a hardening promoter, a filler, a dispersing agent, a flexibilizer, a flame retardant and any combinations thereof.

17. The resin composition of claim 16, wherein the hardening promoter is selected from the group consisting of imidazole, 1-methyl-imidazole (1MI), 2-methyl-imidazole (2MI), 2-ethyl-4-methyl-imidazole (2E4MI), 2-phenyl-imidazole (2PI) and combinations thereof, and is in an amount of about 0.01 parts by weight to about 1 part by weight per 100 parts by weight of the epoxy resin.

18. The resin composition of claim 16, wherein the filler is selected from the group consisting of silica, glass powder, talcum, kaolin, pryan, mica and combinations thereof, and is in an amount of about 0.1 parts by weight to about 120 parts by weight per 100 parts by weight of the epoxy resin.

19. A prepreg, which is prepared by immersing a substrate into the resin composition of claim 1 and drying the immersed substrate.

20. A laminate comprising a synthetic layer and a metal layer, wherein the synthetic layer is made from the prepreg of claim 19.