Semiconductor package integrated with conformal shield and antenna

• US 9,007,273 B2
• Filed: 08/08/2011
• Issued: 04/14/2015
• Est. Priority Date: 09/09/2010
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Liao, Kuo-Hsien, Chan, Chi-Hong, Fuyu, Shih
• Primary Examiner(s): MANCUSO, HUEDUNG XUAN CAO
• Application Number:
  US13/205,558
• Publication Number:
  US 20120062439A1
• Time in Patent Office: 1,345 Days
• Field of Search: 343/702, 343/841, 343/700.MS, 343/792, 342/51, 342/175, 342/45
• US Class Current: 343/841
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1531 the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/526 : Electromagnetic shields

Abstract

A semiconductor package integrated with conformal shield and antenna is provided. The semiconductor package includes a semiconductor element, an electromagnetic interference shielding element, a dielectric structure, an antenna element and an antenna signal feeding element. The electromagnetic interference shielding element includes an electromagnetic interference shielding film and a grounding element, wherein the electromagnetic interference shielding film covers the semiconductor element and the grounding element is electrically connected to the electromagnetic interference shielding layer and a grounding segment of the semiconductor element. The dielectric structure covers a part of the electromagnetic interference shielding element and has an upper surface. The antenna element is formed adjacent to the upper surface of the dielectric structure. The antenna signal feeding element passing through the dielectric structure electrically connects the antenna element and the semiconductor element.

Claims

1. A semiconductor package, comprising:

a semiconductor die, the semiconductor die having an integrated circuit portion and a substrate portion, the integrated circuit portion having an active surface and the substrate portion having an inactive surface;

a via extending from the inactive surface and electrically connected to the integrated circuit portion;

an electromagnetic interference shield disposed on the inactive surface and electrically connected to the via;

a package body encapsulating portions of the die and the electromagnetic interference shield, the package body having an upper surface;

a feeding element extending from the upper surface and electrically connected to the integrated circuit portion; and

an antenna disposed directly on the upper surface and electrically connected to the feeding element.

2. The semiconductor package of claim 1, wherein the electromagnetic interference shield includes a conformal shielding film.

3. The semiconductor package of claim 1, wherein the via is a through silicon via formed in the substrate portion.

4. The semiconductor package of claim 1, wherein the via provides a ground path for the electromagnetic interference shield.

5. The semiconductor package of claim 1, wherein the feeding element includes a conductive via.

6. The semiconductor package according to claim 1, wherein the package body has an opening from which the feeding element is exposed.

7. The semiconductor package of claim 6, wherein the feeding element comprises a first feeding sub-element and a second feeding sub-element, the first feeding sub-element passing through the substrate portion, and the second feeding sub-element passing through the package body.

8. The semiconductor package of claim 1, wherein the electromagnetic shield has an opening such that the feeding element is electrically isolated from the electromagnetic shield.

9. The semiconductor package of claim 7, wherein the first feeding sub-element is a through silicon via.

10. The semiconductor package of claim 1, further including a redistribution layer (RDL) disposed on the active surface and electrically connected thereto.

11. The semiconductor package of claim 1, further including a package substrate wherein the active surface is electrically connected to the package substrate.

12. A semiconductor package, comprising:

a semiconductor die, the semiconductor die having an integrated circuit portion and a substrate portion, the integrated circuit portion having an active surface and the substrate portion having an inactive surface;

a via extending from the inactive surface and electrically connected to the integrated circuit portion;

an electromagnetic interference shield disposed on the inactive surface and electrically connected to the via;

a dielectric layer disposed over the electromagnetic interference shield, the dielectric layer having an upper surface;

a feeding element extending from the upper surface and electrically connected to the integrated circuit portion; and

an antenna disposed directly on the upper surface and electrically connected to the feeding element.

13. The semiconductor package of claim 12, wherein the electromagnetic interference shield has an opening such that the feeding element is electrically isolated from the electromagnetic shield.

14. The semiconductor package of claim 12, wherein the via provides a ground path for the electromagnetic interference shield.

15. The semiconductor package of claim 12, wherein the dielectric layer has an opening from which the feeding element is exposed.

16. The semiconductor package of claim 12, wherein the feeding element comprises a first feeding sub-element and a second feeding sub-element, the first feeding sub-element passing through the substrate portion, and the second feeding sub-element passing through the package body.

17. The semiconductor package of claim 12, further including a redistribution layer (RDL) disposed on the active surface and electrically connected thereto.