Light emitting device package and lighting system

• US 9,035,325 B2
• Filed: 10/25/2010
• Issued: 05/19/2015
• Est. Priority Date: 10/26/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Song, Yong Seon, Hwang, Jung Ha
• Primary Examiner(s): Whalen, Daniel
• Assistant Examiner(s): CHI, SUBERR L
• Application Number:
  US12/911,466
• Publication Number:
  US 20110095321A1
• Time in Patent Office: 1,667 Days
• Field of Search: 3 7/9, 3 8/8, 3 8/6, 3 89- 93, 3 95- 98, 310/0, 310/2, 310/3, 3E3/300.1, 3E3/300.5, 3E3/300.6, 3E33055-E33061, 3E3/306.6, 257/79, 257/88, 257/86, 257 89- 93, 257 95-100, 257/102, 257/103, 257/E33.001, 257/E33.005, 257/E33.006, 257E33055-E33061, 257/E33.066, 257/E33.059, 438/48
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.

Claims

1. A light emitting device package comprising:

a submount including a chip region and a supporting region;

a light emitting chip over the chip region of the submount; and

an encapsulating material and a fluorescent material over the chip, wherein;

the encapsulating material is at least partially transparent,

a coverage area of the encapsulating material and fluorescent material is substantially coextensive with the chip region,

a top surface of the chip region includes at least one groove between the light emitting chip and an edge of the chip region, the encapsulating material extending into the at least one groove, and

the chip region comprises a sidewall, wherein a bottom-most portion of the sidewall is lower than the at least one groove,

wherein a lateral width of a third region between the at least one groove and the chip is smaller than a lateral width of the supporting region.

2. The package of claim 1, wherein the at least one groove is a continuous groove.

3. The package of claim 1, wherein the top surface of the chip region includes a plurality of grooves.

4. The package of claim 1, wherein the top surface of the chip region is higher than a top surface of the supporting region.

5. The package of claim 1, wherein the groove is formed inside the top surface of the chip region of the submount.

6. The package of claim 1, wherein the groove is formed in a top most surface of the chip region, wherein the top most surface of the chip region comprises silicon.

7. The package of claim 1, wherein the lateral width of the third region between the at least one groove and the chip is smaller than a lateral width of the at least one groove.

8. The package of claim 1, wherein the encapsulating material vertically overlaps with the chip region, and

wherein the encapsulating material does not vertically overlap with the supporting region.

9. The package of claim 1, wherein the chip region comprises a same material as the supporting region.

10. The package of claim 1, wherein the encapsulating material comprises one encapsulating layer.

11. The package of claim 1, wherein a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.

12. The package of claim 11, wherein the first area is located on a top surface of the supporting region and the second area is located on a top surface of the chip region.

13. The package of claim 1, wherein a length of a surface between the edge of the chip region and the chip is substantially equal to a thickness of the chip.

14. The package of claim 1, wherein a length of a surface between the edge of the chip region and the chip is greater than a thickness of the chip.

15. The package of claim 1, wherein the encapsulating material has a substantially elliptical or semi-spherical shape.

16. The package of claim 1, wherein the at least one groove is disposed between the light emitting chip and the edge of the chip region.

17. The package of claim 1, wherein the chip region protrudes vertically beyond the supporting region.

18. A lighting system including the package of claim 1, wherein the package is mounted over a substrate of a light emitting module.