Semiconductor device

• US 9,048,721 B2
• Filed: 05/25/2012
• Issued: 06/02/2015
• Est. Priority Date: 09/27/2011
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Keihin Corporation (Hitachi, Ltd.)
• Inventors: Abe, Hidefumi, Abe, Seiichiro, Mayumi, Toshiro, Shiba, Toru, Yagi, Takuya
• Primary Examiner(s): Sinclair, David M
• Assistant Examiner(s): BROWN, ROBERT D
• Application Number:
  US13/480,633
• Publication Number:
  US 20130075886A1
• Time in Patent Office: 1,103 Days
• Field of Search: 36167946-67954, 361688-723, 165 801- 805, 165/104.33, 257712-722, 174 151- 152, 174 161- 163
• US Class Current: 1/1
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A semiconductor device is provided with: a semiconductor element; and a connecting conductor that electrically connects at least one of an input terminal and an output terminal of the semiconductor element to a connection terminal of an electronic device. In this semiconductor device, the connecting conductor is a block structure.

Claims

1. A semiconductor device comprising:

a semiconductor element;

an input connecting conductor that electrically connects an input terminal of the semiconductor element;

an output connecting conductor that electrically connects an output terminal of the semiconductor element; and

a case accommodating the semiconductor element, a part of the input connecting conductor and a part of the output connecting conductor,

wherein the input connecting conductor and the output connecting conductor are block structures opposed to each other with the semiconductor element being disposed between the input connecting conductor and the output connecting conductor, in the case.

2. The semiconductor device according to claim 1, wherein the output connecting conductor is the block structure that has a single layer structure and electrically connects the output terminal of the semiconductor element to a connection terminal of an external device.

3. The semiconductor device according to claim 2, wherein the case is made of a resin and the output connecting conductor is integrally formed with the case and fixed to the case.

4. The semiconductor device according to claim 2, wherein the output connecting conductor includes a screw fastening unit that fastens the output terminal or the connection terminal and the screw fastening unit, which fastens the connection terminal, is formed at a protruding end that is a portion of the output connecting conductor extending out from the case while penetrating the same.

5. The semiconductor device according to claim 2, wherein the output connecting conductor is made of an aluminum material.

6. The semiconductor device according to claim 1, further comprising:

a condenser that is electrically connected to the semiconductor element,

wherein the input connecting conductor includes a plurality of connecting conductors, and the input plurality of connecting conductors have single layer structures and electrically connect an input terminal of the semiconductor element to a connection terminal of the condenser.

7. The semiconductor device according to claim 6, wherein the plurality of connecting conductors includes a first connecting conductor and a second connecting conductor that is arranged to deviate from the first connecting conductor.

8. The semiconductor device according to claim 6, wherein each of the plurality of connecting conductors includes a screw fastening unit that fastens the input terminal or the connection terminal.

9. The semiconductor device according to claim 6, wherein the plurality of connecting conductors is made of an aluminum material.