Apparatus and method for decapsulating packaged integrated circuits

  • US 9,059,184 B2
  • Filed: 12/19/2011
  • Issued: 06/16/2015
  • Est. Priority Date: 12/19/2011
  • Status: Active Grant
First Claim
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1. A method for decapsulating a portion of an encapsulated integrated circuit including copper elements, comprising the steps of:

  • (a) delivering etchant mixture in variable but precise, pressurized micro-metered pulses to a single outlet port of a pump from any one of or a combination of separate inlet ports connected to separate etchant source containers holding specific etchant solutions;

    (b) controlling temperature of the etchant mixture at or below ambient temperature by passing the etchant mixture from the outlet port through a serpentine passage in a temperature-controlled metal block; and

    (c) delivering etchant mixture from the serpentine passage of the temperature-controlled block via a delivery conduit to an encapsulation surface of the encapsulated integrated circuit, wherein the etchant mixture is controlled at or below ambient temperature thereby minimizing damage to the copper elements.

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