Package substrate, manufacturing method thereof, and mold therefor
First Claim
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1. A method of manufacturing a package substrate, the method comprising:
- preparing a chip component and a substrate;
mounting the chip component on a main surface of the substrate;
preparing a mold having a cavity, protrusions formed on a ceiling surface thereof, and two opposing lateral surfaces, the mold including a gate formed on one of the two lateral surfaces and an air vent formed on the other of the two lateral surfaces;
disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and
forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity, the resin being injected from the gate toward the air vent, in a direction intersecting that of the protrusions formed on the ceiling surface of the mold,the protrusions being longer than a distance of a space between the ceiling surface of the upper mold and a chip component disposed in the cavity and shorter than a distance of a space between the ceiling surface of the upper mold and the substrate disposed in the cavity.
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Abstract
There are provided a package substrate, a manufacturing method thereof, and a mold therefor. The method of manufacturing a package substrate includes: preparing a chip component and a substrate; mounting the chip component on a main surface of the substrate; preparing a mold having a cavity and protrusions formed on a ceiling surface thereof; disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity.
11 Citations
15 Claims
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1. A method of manufacturing a package substrate, the method comprising:
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preparing a chip component and a substrate; mounting the chip component on a main surface of the substrate; preparing a mold having a cavity, protrusions formed on a ceiling surface thereof, and two opposing lateral surfaces, the mold including a gate formed on one of the two lateral surfaces and an air vent formed on the other of the two lateral surfaces; disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity, the resin being injected from the gate toward the air vent, in a direction intersecting that of the protrusions formed on the ceiling surface of the mold, the protrusions being longer than a distance of a space between the ceiling surface of the upper mold and a chip component disposed in the cavity and shorter than a distance of a space between the ceiling surface of the upper mold and the substrate disposed in the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 14, 15)
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9. A mold for manufacturing a package substrate, the mold comprising:
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an upper mold; and a lower mold combined to the upper mold to provide a cavity, wherein the upper mold has protrusions formed on a ceiling surface thereof within the cavity, and at least one of the upper mold and the lower mold has two opposing lateral surfaces and includes a gate formed on one of the two lateral surfaces and an air vent formed on the other of the two lateral surfaces, and the protrusions are longer than a distance of a space between the ceiling surface of the upper mold and a chip component disposed in the cavity and shorter than a distance of a space between the ceiling surface of the upper mold and the substrate disposed in the cavity. - View Dependent Claims (10, 11, 12, 13)
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Specification