Light emitting diode package and method for fabricating same

  • US 9,070,850 B2
  • Filed: 10/31/2007
  • Issued: 06/30/2015
  • Est. Priority Date: 10/31/2007
  • Status: Active Grant
First Claim
Patent Images

1. An LED package, comprising:

  • a submount comprising a top surface and a bottom surface;

    a plurality of top electrically and thermally conductive elements on said top surface of said submount;

    an LED on one of said top electrically and thermally conductive elements, an electrical signal applied to said top electrically and thermally conductive elements causing said LED to emit light, said top electrically and thermally conductive elements spreading heat from said LED across the majority of said submount top surface;

    a bottom thermally conductive element on said bottom surface not in electrical contact with said top electrically and thermally conductive elements and conducting heat from said submount;

    a lens over said LED; and

    a protective layer in direct contact with and extending from a bottom of said lens;

    wherein at least a portion of said lens is above a top surface of said protective layer.

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