Solid state lighting component

• US 9,076,940 B2
• Filed: 08/20/2013
• Issued: 07/07/2015
• Est. Priority Date: 01/10/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald
• Primary Examiner(s): DANG, PHUC T
• Application Number:
  US13/971,547
• Publication Number:
  US 20130341653A1
• Time in Patent Office: 686 Days
• Field of Search: 257/89, 257/91, 257/98, 362/235, 362/249, 362/252
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05B 45/40 Details of LED load circuits

Abstract

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Claims

1. A monolithic emitter package comprising:

a plurality of emitters in an array;

a substantially flat optical element directly on said emitters;

a shaped optical element directly on said flat optical element and over said array, said shaped optical element comprising a plurality of optical features for beam shaping.

2. The emitter package of claim 1, wherein said optical features comprise convex features.

3. The emitter package of claim 1, wherein said optical features comprise concave features.

4. The emitter package of claim 1, wherein said optical features comprise convex and concave features.

5. The emitter package of claim 1, wherein the primary emission surface of said shaped optical element is at least partially defined by said optical features.

6. The emitter package of claim 1, wherein one of said optical features is over each of said emitters.

7. The emitter package of claim 1, wherein each of said emitters is below a corresponding optical feature.

8. The emitter package of claim 1, wherein said shaped optical element is spaced away from said array by said flat optical element.

9. The emitter package of claim 1, wherein said first and second optical elements form at least part of a Fresnel lens.

10. The emitter package of claim 1, wherein said first and second optical elements are overmolded.

11. The emitter package of claim 1, wherein said substantially flat optical element is between said emitters and said shaped optical element.

12. The emitter package of claim 1, further comprising patterned conductive features comprising an electrically and thermally conductive material;

wherein said emitters are electrically connected to said patterned conductive features.

13. The emitter package of claim 12, wherein said patterned conductive features comprise die attach pads and interconnected electrical traces;

wherein said die attach pads and interconnected electrical traces comprise said electrically and thermally conductive material.

14. The emitter package of claim 1, further comprising:

a submount comprising a planar surface, wherein the substantially flat optical element is directly on the planar surface.

15. A light emitting diode (LED package comprising:

an LED chip array; and

an aggregate overmolded lens comprising two or more portions over said LED chip array;

wherein a first of said portions comprises a plurality of optical features for beam shaping; and

wherein a second of said portions is substantially flat and is directly on said LED chip array;

wherein said first of said portions is directly on said second of said portions.

16. The LED package of claim 15, wherein said first portion is distal from said LED chip array.

17. The LED package of claim 16, wherein said second port ion is between said LED chip array and said first portion.

18. The LED package of claim 15, wherein said optical features are shaped.

19. The LED package of claim 15, wherein said optical features comprise convex or concave features.

20. The LED package of claim 15, wherein a primary emission surface of said lens is at least partially defined by said optical features.

21. The LED package of claim 15, wherein said second portion encapsulates said LED chip array without intervening encapsulants.

22. The LED package of claim 15, further comprising patterned conductive features comprising an electrically and thermally conductive material;

wherein said LED chip array is electrically connected to said patterned conductive features.

23. The LED package of claim 22, wherein said patterned conductive features comprise die attach pads and interconnected electrical traces;

wherein said die attach pads and interconnected electrical traces comprise said electrically and thermally conductive material.

24. The LED package of claim 15, further comprising:

a submount comprising a planar surface, wherein the aggregate overmolded lens is directly on the planar surface.