System and method of manufacturing an electromechanical device by printing raised conductive contours

• US 9,090,456 B2
• Filed: 11/16/2009
• Issued: 07/28/2015
• Est. Priority Date: 11/16/2009
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Khonsari, Nassim
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US12/619,521
• Publication Number:
  US 20110113616A1
• Time in Patent Office: 2,080 Days
• Field of Search: 29830-831, 29846-847, 298/52, 295/921, 298/25, 257/704, 257692-698
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/098 Arrangements not provided for in groups B81B2207/092 - B81B2207/097
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2201/0184 Digital lithography, e.g. using an inkjet print-head
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/51 Plural diverse manufacturing apparatus including means for metal shaping or assembling

Abstract

A system and method for manufacturing a display device having an electrically connected front plate and back plate are disclosed. In one embodiment, the method comprises printing conductive raised contours onto a non-conductive back plate, aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings, and sealing the back plate and the front plate.

Claims

1. A method of manufacturing an electromechanical device, the method comprising:

printing conductive raised contours and conductive traces onto a non-conductive back plate;

aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings;

printing a mesh on the back plate; and

sealing the back plate and the front plate.

2. The method of claim 1, wherein the conductive traces electrically connect the conductive routings to driver circuitry.

3. The method of claim 1, wherein the conductive traces electrically connect the conducting routings to one or more conductive vias extending through the back plate.

4. The method of claim 1, further comprising depositing a desiccant within the printed mesh.

5. The method of claim 1, further comprising plating the conductive routings on the front plate.

6. The method of claim 1, further comprising generating a plurality of display elements on the front plate.

7. The method of claim 6, wherein the display elements are interferometric modulators.

8. A method of manufacturing an electromechanical device, the method comprising:

inkjet printing conductive raised contours onto a non-conductive back plate;

aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings;

printing a mesh on the back plate; and

sealing the back plate and the front plate.