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Sensing devices and methods

  • US 9,097,638 B2
  • Filed: 08/11/2011
  • Issued: 08/04/2015
  • Est. Priority Date: 08/11/2010
  • Status: Active Grant
First Claim
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1. A sensing device, comprising:

  • a first surface acoustic wave (SAW) component, wherein the first SAW component is a temperature component and wherein silicon dioxide (SiO2) is formed only on one surface of an interdigitated transducer (IDT) of the first SAW component;

    a second SAW component, wherein the second SAW component is a humidity component and wherein silicon dioxide (SiO2) is formed only on one surface of an interdigitated transducer (IDT) of the second SAW component;

    a third SAW component, wherein the third SAW component is a temperature reference component and wherein silicon dioxide (SiO2) is formed only on one surface of an interdigitated transducer (IDT) of the third SAW component; and

    a piezoelectric layer, wherein the first SAW component, the second SAW component, and the third SAW component are on a surface of the piezoelectric layer.

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