Sensor device

• US 9,110,002 B2
• Filed: 07/16/2012
• Issued: 08/18/2015
• Est. Priority Date: 11/13/2006
• Status: Active Grant

• Current Assignee: Vishay Bccomponents Beyschlag GMBH (Vishay Intertechnology Incorporated)
• Original Assignee: Vishay Bccomponents Beyschlag GMBH (Vishay Intertechnology Incorporated)
• Inventors: Werner, Wolfgang, Aurich, Joachim, Werth, Sascha
• Primary Examiner(s): Jagan, Mirellys
• Application Number:
  US13/549,930
• Publication Number:
  US 20130039380A1
• Time in Patent Office: 1,128 Days
• Field of Search: 374/27, 374/28, 361/286
• US Class Current: 1/1
• CPC Class Codes: G01N 27/121 for determining moisture content, e.g. humidity, of the fluid moisture content of the tested material G01N27/048
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.

Claims

1. A sensor device including a resistance layer arranged on a substrate, the sensor device having a moisture-sensitive hydrophilic surface, the sensor device comprising a plurality of interdigital electrodes with recesses formed between the interdigital electrodes, the surface comprising thaw-detecting condensation cores sintered onto the interdigital electrodes and the recesses, wherein the recesses extend through at least a portion of the resistive layer and at least a portion of the substrate.

2. The sensor device according to claim 1, wherein the condensation cores comprise evaporated parts of the resistance layer and parts of the substrate.

3. The sensor device according to claim 1, wherein, if any condensation cores are not sintered onto the surface, non sintered-on condensation cores are removed.

4. The sensor device according to claim 1, wherein the recesses are produced by laser beams, wherein the density of the condensation cores on the interdigital electrodes increases in the direction of the recesses.

5. The sensor device according to claim 1, wherein the interdigital electrodes are formed in a resistance layer of a substrate of the sensor device.

6. The sensor device according to claim 5, wherein the substrate is one of aluminium oxide, circuit board material, glass, or glass ceramic.

7. The sensor device according to claim 5, wherein two terminal contacts are applied to the substrate, and wherein the contacts are connected to interdigital electrodes.

8. The sensor device according to claim 5, wherein the resistance layer comprises a metal oxide layer.

9. The sensor device according to claim 8, wherein the metal oxide layer comprises ruthenium oxides, ruthenates, or iridium oxides.

10. The sensor device according to claim 8, wherein the metal oxide layer is a metal oxide paste.

11. A method for forming a moisture-sensitive hydrophilic surface on a sensor device having a resistive layer arranged on a substrate, the sensor device comprising a plurality of interdigital electrodes with recesses formed between the interdigital electrodes, the method comprising sintering thaw-detecting condensation cores onto the interdigital electrodes and the recesses, wherein the recesses extend through at least a portion of the resistive layer and at least a portion of the substrate.

12. The method according to claim 11, wherein the method is not carried out in a vacuum.

13. The method according to claim 11, wherein the recesses are formed by the application of laser radiation.

14. The method according to claim 13, wherein laser radiation is carried out at a wavelength from 248 nm to 1200 nm.

15. The method according to claim 11, wherein the interdigital electrodes are formed in the resistance layer.

16. The method according to claim 15, wherein the substrate is formed from an aluminium oxide ceramic.

17. The method according to claim 15, further comprising applying contact electrodes to the substrate.

18. The method according to claim 15, wherein the interdigital electrodes are formed in the resistance layer by heating, melting and evaporating parts of the substrate and resistance layer by laser radiation.

19. The method according to claim 15, wherein a reaction zone, in which heating, melting and evaporation of the substrate and the resistance layer takes place, is formed by laser radiation.

20. The method according to claim 15, wherein the interdigital electrodes are formed from a metal oxide layer.

21. The method according to claim 20, wherein the metal oxide layer comprises ruthenium oxide, ruthenates, or iridium oxides.