Chemical sensor with sidewall sensor surface

• US 9,116,117 B2
• Filed: 03/05/2014
• Issued: 08/25/2015
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Life Technologies Corporation (Thermo Fisher Scientific Incorporated)
• Original Assignee: Life Technologies Corporation (Thermo Fisher Scientific Incorporated)
• Inventors: Fife, Keith G., Owens, Jordan, Li, Shifeng, Bustillo, James
• Primary Examiner(s): Kusumakar, Karen
• Assistant Examiner(s): Bowen, Adam S
• Application Number:
  US14/197,710
• Publication Number:
  US 20140264469A1
• Time in Patent Office: 538 Days
• Field of Search: 257/253, 438/49
• US Class Current: 1/1
• CPC Class Codes: G01N 27/4145 specially adapted for biomolecules, e.g. gate electrode with immobilised receptors

Abstract

In one embodiment, a chemical sensor is described. The chemical sensor includes a chemically-sensitive field effect transistor including a floating gate conductor. A material defines an opening overlying the floating gate conductor. The material comprises a conductive element having an inner surface defining a lower portion of a sidewall of the opening. A dielectric is on the conductive element and has an inner surface defining an upper portion of the sidewall.

Claims

1. A chemical sensor comprising:

a chemically-sensitive field effect transistor including a floating gate conductor; and

a material defining an opening overlying the floating gate conductor, the material comprising a conductive element having an inner surface defining a lower portion of a sidewall of the opening, and a dielectric on the conductive element and having an inner surface defining an upper portion of the sidewall, wherein the inner surface of the conductive element is substantially aligned with the inner surface of the dielectric.

2. The chemical sensor of claim 1, wherein the sidewall of the opening is an outer surface of a reaction region for the chemical sensor.

3. The chemical sensor of claim 1, wherein the conductive element contacts the floating gate conductor.

4. The chemical sensor of claim 1, wherein the conductive element extends across an upper surface of the floating gate conductor.

5. The chemical sensor of claim 1, wherein the conductive element comprises an electrically conductive material, and the inner surface of the conductive element includes an oxide of the electrically conductive material.

6. The chemical sensor of claim 1, wherein a sensing surface of the chemical sensor includes the inner surface of the conductive element.

7. The chemical sensor of claim 1, wherein the chemically-sensitive field effect transistor generates a sensor signal in response to a chemical reaction occurring within the opening.

8. The chemical sensor of claim 7, wherein the chemical reaction is a sequencing reaction.

9. The chemical sensor of claim 1, further comprising a microfluidic structure in fluid flow communication with the chemically-sensitive field effect transistor, and arranged to deliver analytes for sequencing.

10. A method for manufacturing a chemical sensor, the method comprising:

forming a chemically-sensitive field effect transistor including a floating gate conductor; and

forming a material defining an opening overlying the floating gate conductor, wherein forming the material comprises;

forming a conductive element having an inner surface defining a lower portion of a sidewall of the opening;

forming a first dielectric on the conductive element and having an inner surface defining an upper portion of the sidewall;

forming a second dielectric on the floating gate conductor, the second dielectric defining a cavity extending to an upper surface of the floating gate conductor;

filling the cavity with conductive material;

forming the first dielectric on the conductive material; and

etching the first dielectric and the conductive material to form the opening.

11. The method of claim 10, wherein etching the first dielectric and the conductive material comprises:

etching the first dielectric to expose the conductive material within the cavity; and

partially etching the exposed conductive material using the etched first dielectric as an etch mask.

12. The method of claim 11, wherein partially etching the exposed conductive material comprises performing a timed etch process.

13. The method of claim 11, wherein partially etching the exposed conductive material leaves remaining conductive material on the upper surface of the floating gate conductor.

14. The method of claim 10, wherein filling the cavity with the conductive material comprises:

depositing the conductive material within the cavity and on the upper surface of the second dielectric; and

performing a planarization process to expose the upper surface of the second dielectric.

15. The method of claim 10, wherein the sidewall of the opening is an outer surface of a reaction region for the chemical sensor.

16. The method of claim 10, wherein the conductive element comprises an electrically conductive material, and the inner surface of the conductive element includes an oxide of the electrically conductive material.

17. The method of claim 10, wherein a sensing surface of the chemical sensor includes the inner surface of the conductive element.

18. The method of claim 10, wherein the conductive element extends across an upper surface of the floating gate conductor.