Device for applying a microneedle array

• US 9,119,945 B2
• Filed: 04/20/2007
• Issued: 09/01/2015
• Est. Priority Date: 04/20/2006
• Status: Active Grant

• Current Assignee: Kindeva Drug Delivery L.P.
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Simons, John K., Frederickson, Franklyn L.
• Primary Examiner(s): Bosworth, Kami A
• Assistant Examiner(s): CARPENTER, WILLIAM R
• Application Number:
  US12/296,590
• Publication Number:
  US 20090198189A1
• Time in Patent Office: 3,056 Days
• Field of Search: 604/173, 604/20, 604/21, 604/22, 604/191
• US Class Current: 1/1
• CPC Class Codes: A61M 2037/0023 Drug applicators using microneedles
• CPC Class Codes: A61M 2037/0061 Methods for using microneedles
• CPC Class Codes: A61M 37/0015 by using microneedles

Abstract

A device (100) for applying a microneedle array to a skin surface. The device comprises a base (120) defining a skin contacting plane, an array component having a skin facing side comprising a microneedle array, and at least one connecting member (140) having a first portion affixed through a first hinge (142) to the base and a second portion affixed to the array component. The connecting member has a first equilibrium position with the microneedle array in a recessed position within the device and a second equilibrium position with the microneedle array positioned so as to be able to contact a skin surface.

Claims

1. A device for applying a microneedle array to a skin surface comprising:

a base defining a skin contacting plane;

an array component having a skin facing side comprising a microneedle array;

a plurality of connecting members, each connecting member having a first portion affixed through a first hinge to the base and a second portion affixed to the array component through a second hinge;

wherein the connecting member has a first equilibrium position with the microneedle array in a recessed position within the device;

wherein the connecting member has a second equilibrium position with the microneedle array positioned so that at least a portion of the microneedle array penetrates a skin surface after removal of pressure that moves the connecting member from the first equilibrium position to the second equilibrium position;

wherein in the second equilibrium position, the second hinge is closer to the skin contacting plane than the first hinge; and

wherein the device comprises at least one of the following;

(i) the connecting member comprises one or more non-linear sections,

(ii) the cross-sectional thickness of the base is larger than the cross-sectional thickness of the connecting member, or

(iii) the first hinge is selected from the group consisting of (a) a separate hinge component and (b) a living hinge.

2. A device as claimed in claim 1, wherein the device has four connecting members.

3. A device as claimed in claim 1, wherein the base comprises a pressure-sensitive skin adhesive disposed along the skin-contacting plane.

4. A device as claimed in claim 1, wherein the microneedle array is substantially parallel to the skin contacting plane in both the first equilibrium position and the second equilibrium position.

5. A device as claimed in claim 4, wherein the microneedle array remains substantially parallel to the skin contacting plane when moving from the first equilibrium position to the second equilibrium position.

6. A device as claimed in claim 1, wherein at least one connecting member, at least one hinge, and the base are integrally formed.

7. A device as claimed in claim 1, wherein at least one connecting member, at least one hinge, the base, and the array component are integrally formed.

8. A device as claimed in claim 1, wherein the array component and at least one connecting member are formed of dissimilar materials.

9. A device as claimed in claim 1, wherein the device is in the first equilibrium position and further comprises a covering member releasably affixed to the base.

10. A device as claimed in claim 1, wherein the microneedle array comprises a plurality of microneedles with a height of less than about 500 microns.

11. A device as claimed in claim 1, wherein the array component comprises a backing plate and a microneedle array.

12. A device as claimed in claim 11 wherein the microneedle array is releasably attached to the backing plate.

13. A device as claimed in claim 1, wherein the microneedle array further comprises a dried coating on at least a portion of the microneedle surfaces.

14. A device as claimed in claim 13, wherein the dried coating comprises a drug.

15. A device as claimed in claim 13, wherein the dried coating comprises a vaccine.

16. A device as claimed in claim 1, wherein in the first equilibrium position, the second hinge is farther from the skin contacting plane than the first hinge.

17. A device as claimed in claim 16, wherein in the first equilibrium position, the microneedle array is between the first hinge and the second hinge, with respect to the skin contacting plane.

18. A device as claimed in claim 1, wherein in the first equilibrium position, at the first hinge, the connecting member and the base form an obtuse angle on a skin facing side.

19. A device as claimed in claim 1, wherein the pressure that moves the connecting member from the first equilibrium position to the second equilibrium position moves the connecting member relative to the array component.

20. A method of applying a microneedle array to a skin surface comprising the steps of:

providing a device a base defining a skin contacting plane;

an array component having a skin facing side comprising a microneedle array;

a plurality of connecting members, each connecting member having a first portion affixed through a first hinge to the base and a second portion affixed to the array component;

through a second hinge;

wherein the connecting member has a first equilibrium position with the microneedle array in a recessed position within the device;

wherein the connecting member has a second equilibrium position with the microneedle array positioned so that at least a portion of the microneedle array penetrates a skin surface after removal of pressure that moves the connecting member from the first equilibrium position to the second equilibrium position;

wherein in the second equilibrium position, the second hinge is closer to the skin contacting plane than the first hinge;

wherein the device comprises at least one of the following;

(i) the connecting member comprises one or more non-linear sections,

(ii) the cross-sectional thickness of the base is larger than the cross-sectional thickness of the connecting member, or

(iii) the first hinge is selected from the group consisting of (a) a separate hinge component and (b) a living hinge;

placing the device on a skin surface; and

applying a force to the array component sufficient to move the plurality of connecting members to the second equilibrium position.

21. A method as claimed in claim 20, wherein the force is applied using a mechanical applicator.