Method, apparatus, and kit for protecting an electronic device
First Claim
Patent Images
1. A method for applying protective film to a device, the method comprising:
- obtaining a protective film having an adhesive disposed thereon and a backing covering the adhesive;
removing the backing to expose the adhesive;
applying a gel to the adhesive to temporarily deactivate bonding of the protective film;
aligning the protective film on the device; and
applying the protective film to the device after the protective film is properly aligned.
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Abstract
A method, apparatus, and kit for protecting an electronic device is disclosed and described. The apparatus can include a protective film with an adhesive disposed on one side thereof and a backing covering the adhesive. The adhesive can be configured to bond to a surface of the device and can be configured to allow an optional gel to temporarily deactivate bonding of the protective film to the surface of the device. The backing can comprise a tab in order for a portion of the backing to be removed from the protective film. Additionally, the protective film can have anti-microbial properties on an exposed surface.
75 Citations
9 Claims
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1. A method for applying protective film to a device, the method comprising:
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obtaining a protective film having an adhesive disposed thereon and a backing covering the adhesive; removing the backing to expose the adhesive; applying a gel to the adhesive to temporarily deactivate bonding of the protective film; aligning the protective film on the device; and applying the protective film to the device after the protective film is properly aligned. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification