Wireless IC device

• US 9,123,996 B2
• Filed: 04/18/2011
• Issued: 09/01/2015
• Est. Priority Date: 05/14/2010
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Kaishita, Nihei, Nonogaki, Hiroshi, Goto, Ryohei, Yamaguchi, Takahiro, Ikeda, Kazuyuki
• Primary Examiner(s): Kundu, Sujoy
• Assistant Examiner(s): Malone, Steven J
• Application Number:
  US13/088,480
• Publication Number:
  US 20110279326A1
• Time in Patent Office: 1,597 Days
• Field of Search: 343/700.MS
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.

Claims

1. A product comprising:

a body including a curved metal surface; and

a wireless IC device attached to the curved metal surface;

wherein the wireless IC device includes;

a dielectric body including an upper surface and a lower surface;

a radiator provided on the dielectric body; and

a wireless IC element coupled to a feeding portion of the radiator;

the radiator is a metal pattern that is flexible;

the metal pattern extends from the upper surface of the dielectric body to the lower surface of the dielectric body;

the dielectric body has a laminated structure including a plurality of dielectric layers that are flexible, and adjacent ones of the plurality of dielectric layers in a lamination direction include non-bonded surfaces that slide relative to one another when the dielectric body is bent; and

the radiator is bonded to the upper surface of the dielectric body with no gap therebetween and to the lower surface of the dielectric body with no gap therebetween, the radiator is not bonded to a side surface of the dielectric body extending between the upper surface and the lower surface, and a gap is provided between the radiator and the side surface of the dielectric body.

2. The product according to claim 1, wherein the radiator is arranged inside ridge portions of the dielectric body.

3. The product according to claim 1, wherein

the dielectric body is obtained by folding at least one of the plurality of dielectric layers;

and

an inner surface obtained after the dielectric body has been folded defines the non-bonded surface.

4. The product according to claim 1, wherein

at least portions of surfaces of adjacent ones of the plurality of dielectric layers in the lamination direction define the non-bonded surfaces.

5. The product according to claim 1, wherein

the radiator extends continuously from the upper surface to the lower surface via the side surface of the dielectric body.

6. The product according to claim 1, wherein the radiator is provided on a film that is flexible.

7. The product according to claim 1, further comprising a protection member arranged to cover the dielectric body, the radiator, and the wireless IC element.

8. The product according to claim 1, wherein the wireless IC element is a wireless IC chip arranged to process a predetermined radio signal.

9. The product according to claim 8, wherein the wireless IC element includes the wireless IC chip and a feeding circuit board including a feeding circuit having a predetermined resonance frequency.

10. The product according to claim 1, wherein the radiator is provided on the dielectric body so as to extend continuously from the upper surface to the lower surface of the dielectric body.

11. A device product comprising:

a body including a curved metal surface; and

a wireless IC device attached to the curved metal surface;

wherein

the wireless IC device includes;

a dielectric body including an upper surface and a lower surface;

a radiator provided on the dielectric body;

a wireless IC element coupled to a feeding portion of the radiator; and

a protection member arranged to cover the dielectric body, the radiator, and the wireless IC element;

the radiator includes a metal pattern that is flexible;

the metal pattern extends from the upper surface of the dielectric body to the lower surface of the dielectric body;

the dielectric body has a laminated structure including a plurality of dielectric layers that are flexible, and adjacent ones of the plurality of dielectric layers in a lamination direction include non-bonded surfaces that slide relative to one another when the dielectric body is bent;

the dielectric body is covered by the protection member, is sealed by a film, and is attached to a surface of a metal body via the film; and

the radiator is bonded to the upper surface of the dielectric body with no gap therebetween and to the lower surface of the dielectric body with no gap therebetween, the radiator is not bonded to a side surface of the dielectric body extending between the upper surface and the lower surface, and a gap is provided between the radiator and the side surface of the dielectric body.

12. The product according to claim 11, wherein the radiator is provided on the dielectric body so as to extend continuously from the upper surface to the lower surface of the dielectric body.