Implantable biocompatible component integrating an active sensor for measurement of a physiological parameter, a micro-electromechanical system or an integrated circuit

• US 9,126,825 B2
• Filed: 09/24/2007
• Issued: 09/08/2015
• Est. Priority Date: 09/25/2006
• Status: Active Grant

• Current Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Original Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Inventors: Molin, Renzo Dal, Ripart, Alain
• Primary Examiner(s): Koharski, Christopher D
• Assistant Examiner(s): D ABREU, MICHAEL JOSEPH
• Application Number:
  US11/860,250
• Publication Number:
  US 20080102096A1
• Time in Patent Office: 2,906 Days
• Field of Search: 607/36
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/06 Bio-MEMS
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals

Abstract

An implantable biocompatible component (10) integrating an active element of the type of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system and an integrated electronic circuit. This component (10) has a substrate (12) and a lid (22) in silicon or quartz. The substrate (12) integrates the active element (14) and biocompatible metallic pads (16), electrically connected to the active element. The lid (22) encompasses and peripherally closes the substrate in a hermetic manner, level with the face integrating the active element. This component is void of metallic case for insulation between the active element and outside environment, and of insulative feedthrough for electrical connection to the active element. The substrate and lid can be directly welded to each other through their faces in vis-à-vis, or by interpositioning a sealing ring made of a biocompatible material.

Claims

1. A micro-fabricated biocompatible component implantable in a human body, comprising:

an active element of the type selected from among the group consisting of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system, and an integrated electronic circuit;

a base substrate having a first face and a second face, said active element being integrated on said first face;

metal pads that are biocompatible formed on said second face of said base substrate, said second face of said base substrate configured to be exposed to said body tissues or fluids when implanted in the human body;

electrical connections integrated on the base substrate for connecting said metal pads to the active element;

holes in the substrate for connecting said metal pads to said electrical connections in contact with said active element, said holes being hollowed through the base substrate and filled with a metal; and

a lid made of silicon or quartz covering and peripherally enclosing said base substrate in a hermetic manner, said lid being a thin film layer deposited on the side of said first face of the base substrate integrating the active element, and having a raised portion such that the lid is separated from the active element to form a cavity, the cavity being free of any filler material;

wherein said lid is formed on the base substrate according to a thin film packaging process; and

wherein said base substrate and said lid form a biocompatible component capable of withstanding prolonged exposure to body tissues or fluids of the human body, and wherein the biocompatible component is essentially void of a metallic case for insulation between said active element and said body tissues or fluids, and void of insulating feedthroughs for electrical connection to the active element.

2. The implantable biocompatible component of claim 1, further comprising a biocompatible sealing material interposed between the first face of the base substrate and a face of the lid wherein the base substrate and the lid are welded by said biocompatible sealing material.

3. The implantable biocompatible component of claim 2, wherein the biocompatible sealing material further comprises a glass.

4. The implantable biocompatible component of claim 2, wherein the biocompatible sealing material further comprises one of a metal, a metallic alloy, gold, and palladium.

5. The implantable biocompatible component of claim 1, wherein the active element comprises radiofrequency (RF) circuits, and wherein at least one metal pad of said metal pads comprises a configuration and dimensions so as to form an antenna for transmitting RF signals.

6. The implantable biocompatible component of claim 5, wherein said RF circuits are remotely power-fed, and wherein at least one metal pad of said metal pads comprises a configuration and dimensions so as to form an antenna for receiving a remote power feed.

7. The implantable biocompatible active component of claim 1, wherein the active element comprises an accelerometer.

8. The implantable biocompatible active component of claim 7, wherein the accelerometer measures endocardial. acceleration (EA) at a tip of a lead implanted in a patient'"'"'s heart.

9. The implantable biocompatible component of claim 1, wherein the first face of said base substrate and a face of said lid are directly sealed to each other.

10. The implantable biocompatible component of claim 1, wherein said metal pads are coated with gold.

11. The implantable biocompatible component of claim 1, wherein the active element further comprises a remotely power-fed circuit.

12. The implantable biocompatible active component of claim 1, wherein the base substrate is made of boron-doped silicon.

13. The implantable biocompatible active component of claim 1, wherein the lid is made of boron-doped silicon.

14. The implantable biocompatible active component of claim 1, wherein the base substrate is made of silicon or quartz.

15. A method of manufacturing a hermetically sealed biocompatible component implantable in a human body, the method comprising:

providing a base substrate having a first face and a second face;

integrating on the first face of the base substrate an active element of the type selected from among the group consisting of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system, and an integrated electronic circuit;

forming hollow holes through the base substrate in the proximity to the active element;

filling the holes with a metal;

integrating electrical connections on the base substrate encompassing the active element and the metal filling the holes;

depositing a sacrificial layer onto the first face of the base substrate encompassing the active element, the holes, and the electrical connections;

depositing a top thin film layer made of silicon or quartz onto the sacrificial layer;

removing the sacrificial layer such that the top thin film layer has a raised portion where the thin film layer is separated from the active element to form a cavity between the active element and the top layer, the cavity being free of any filler material after the sacrificial layer is removed; and

forming metal pads on the second face of the base substrate encompassing the holes, wherein the metal pads are biocompatible, wherein the second face of the base substrate is configured to be exposed to the body tissues or fluids when implanted in the human body and wherein the biocompatible component is capable of withstanding prolonged exposure to body tissues or fluids of the human body.

16. The method of claim 15 further comprising:

interposing a biocompatible sealing material between the first face of the base substrate and a face of the top layer; and

welding the base substrate and the top layer with the biocompatible sealing material.

17. The method of claim 16, wherein the biocompatible sealing material comprises a glass.

18. The method of claim 16, wherein the biocompatible sealing material further comprises one of a metal, a metallic alloy, gold, and palladium.

19. The method of claim 15, wherein said metal pads are coated with gold.

20. The method of claim 15, wherein the base substrate is made of boron-doped silicon.

21. The method of claim 15, wherein the lid is made of boron-doped silicon.

22. The method of claim 15, wherein the base substrate is made of silicon or quartz.