Coil component
First Claim
1. A coil component comprising:
- a substrate;
a planar spiral conductor that is formed on a surface of the substrate by electrolytic plating;
a lead conductor that is formed on the surface of the substrate and connected to an outer peripheral end of the planar spiral conductor;
a dummy lead conductor that is formed on the surface of the substrate and between an outermost turn of the planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane;
an insulating resin layer that is formed on the surface of the substrate to cover the planar spiral conductor, the lead conductor, and the dummy lead conductor;
a metal magnetic powder-containing resin layer that covers the insulating resin layer;
an external electrode that is formed on the metal powder-containing resin layer; and
a bump electrode that penetrates the insulating resin layer and the metal magnetic power-containing resin layer and is connected between the lead conductor and the external electrode, whereinthe external electrode has an area greater than that of the bump electrode,the metal magnetic powder-containing resin layer has a main surface that is substantially parallel to the surface of the substrate and a side surface that is substantially perpendicular to the main surface, andthe external electrode is selectively formed on the main surface of the metal magnetic powder-containing resin layer so that the side surface of the metal magnetic powder-containing resin layer is free from the external electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.
28 Citations
18 Claims
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1. A coil component comprising:
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a substrate; a planar spiral conductor that is formed on a surface of the substrate by electrolytic plating; a lead conductor that is formed on the surface of the substrate and connected to an outer peripheral end of the planar spiral conductor; a dummy lead conductor that is formed on the surface of the substrate and between an outermost turn of the planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane; an insulating resin layer that is formed on the surface of the substrate to cover the planar spiral conductor, the lead conductor, and the dummy lead conductor; a metal magnetic powder-containing resin layer that covers the insulating resin layer; an external electrode that is formed on the metal powder-containing resin layer; and a bump electrode that penetrates the insulating resin layer and the metal magnetic power-containing resin layer and is connected between the lead conductor and the external electrode, wherein the external electrode has an area greater than that of the bump electrode, the metal magnetic powder-containing resin layer has a main surface that is substantially parallel to the surface of the substrate and a side surface that is substantially perpendicular to the main surface, and the external electrode is selectively formed on the main surface of the metal magnetic powder-containing resin layer so that the side surface of the metal magnetic powder-containing resin layer is free from the external electrode. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A coil component comprising:
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a substrate having top and bottom surfaces; a first planar spiral conductor that is formed on the top surface of the substrate by electrolytic plating; a second planar spiral conductor that is formed on the bottom surface of the substrate by electrolytic plating; a first through-hole conductor that penetrates the substrate to connect an inner peripheral end of the first planar spiral conductor with an inner peripheral end of the second planar spiral conductor; a first dummy lead conductor that is formed on the top surface of the substrate and between an outermost turn of the first planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane; a second dummy lead conductor that is formed on the bottom surface of the substrate and between an outermost turn of the second planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane; a first lead conductor that is formed on the top surface of the substrate and vertically overlapped with the second dummy lead conductor, and is connected to an outer peripheral end of the first planar spiral conductor; a second lead conductor that is formed on the bottom surface of the substrate and vertically overlapped with the first dummy lead conductor, and is connected to an outer peripheral end of the second planar spiral conductor; a second through-hole conductor that penetrates the substrate to connect the first dummy lead conductor with the second lead conductor; first and second external electrodes that are formed in parallel with the top surface of the substrate; a first bump electrode that is formed on a surface of the first lead conductor by electrolytic plating and connects the first lead conductor with the first external electrode; and a second bump electrode that is formed on a surface of the first dummy lead conductor by electrolytic plating and connects the first dummy lead conductor with the second external electrode, wherein the first external electrode has an area greater than that of the first bump electrode, and the second external electrode has an area greater than that of the second bump electrode. - View Dependent Claims (8, 9, 10, 11)
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12. A coil component comprising:
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a substrate having top and bottom surfaces opposite to each other; a first spiral conductor formed on the top surface of the substrate; a second spiral conductor formed on the bottom surface of the substrate; a first conductor formed on the top surface of the substrate and connected to an outer peripheral end of the first spiral conductor; a second conductor formed on the top surface of the substrate; a third conductor formed on the bottom surface of the substrate and connected to an outer peripheral end of the second spiral conductor; a first through-hole conductor connected between an inner peripheral end of the first spiral conductor and an inner peripheral end of the second spiral conductor; a second through-hole conductor connected between the second conductor and the third conductor; a first insulating layer formed on the top and bottom surfaces of the substrate to cover the first and second spiral conductors and the first to third conductors; a second insulating layer formed on the top and bottom surfaces of the substrate with an intervention of the first insulating layer; first and second external electrodes formed on the second insulating layer; a first bump electrode connected between the first conductor and the first external electrode; and a second bump electrode connected between the second conductor and the second external electrode. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification