×

Transdermal adhesive patch assembly with removable microneedle array and method of using same

  • US 9,144,671 B2
  • Filed: 12/12/2012
  • Issued: 09/29/2015
  • Est. Priority Date: 12/21/2011
  • Status: Active Grant
First Claim
Patent Images

1. A transdermal adhesive patch assembly, the assembly comprising:

  • a backing having a first major surface and a second major surface;

    a skin-contact adhesive coupled to the second major surface of the backing;

    a matrix comprising an active ingredient, the matrix coupled to the second major surface of the backing;

    a microneedle array located in at least partially overlapping relationship with the matrix; and

    a carrier positioned to couple the microneedle array to the matrix opposite the backing, wherein the carrier and the microneedle array form a skin treatment assembly that is configured to be decoupled from the matrix, when desired, to expose the matrix;

    wherein a portion of the backing and at least a portion of the skin-contact adhesive extend beyond the skin treatment assembly in at least one direction to form an anchor, and wherein the matrix and the skin treatment assembly are located on a flap that is movable with respect to the anchor between a first position in which the flap is not folded back relative to the anchor and a second position in which the flap is folded back relative to the anchor.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×