Light emitting device

• US 9,147,821 B2
• Filed: 09/08/2014
• Issued: 09/29/2015
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Seo, Eun Jung, Cho, Jae Ho, Kim, Bang Hyun
• Primary Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US14/480,042
• Publication Number:
  US 20140374788A1
• Time in Patent Office: 386 Days
• Field of Search: 257/99, 257/98, 257/100, 257/787
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Claims

1. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first portion, and a second portion disposed on the first portion; and

a light-emitting diode chip disposed on the second portion of the first or second lead frame;

wherein each the first and second portions has an uniform thickness, the first and second portions have different planar shapes from each other,

wherein each the first and second portions comprises a sidewall, and at least one of the sidewalls is covered by a resin portion,

wherein the first and second lead frames each comprise a first surface, a second surface opposite to the first surface, and sidewalls disposed between the first and second surfaces, at least one of the sidewalls comprising an inset sidewall partially defining an outer fixing space, and

wherein a second planar area of the outer fixing space disposed between the second portions is smaller than a first planar area of the outer fixing space disposed between the first portions.

2. The light-emitting device of claim 1, wherein at least one of the first and second lead frames comprises at least one inner fixing space filled by the resin.

3. The light-emitting device of claim 1, wherein the first and second portions have different planar-surface areas from each other.

4. The light-emitting device of claim 3, wherein the planar surface area of the second portion is larger than that of the first portion.

5. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first portion, and a second portion disposed on the first portion; and

a light-emitting diode chip disposed on the second portion of the first or second lead frame;

wherein each the first and second portions has an uniform thickness, the first and second portions have different planar shapes from each other,

wherein each the first and second portions comprises a sidewall, and at least one of the sidewalls is covered by a resin portion,

wherein the first and second lead frames each comprise a first surface, a second surface opposite to the first surface, and sidewalls disposed between the first and second surfaces, at least one of the sidewalls comprising an inset sidewall partially defining an outer fixing space,

wherein at least one of the first and second lead frames comprises at least one inner fixing space filled by the resin, and,

wherein the inner fixing space comprises a fixing hole.

6. The light-emitting device of claim 5, wherein at least one of the first fixing holes penetrates the second portion and connects to the outer fixing space disposed beside the second portion.

7. The light-emitting device of claim 5, wherein the second portion comprises first fixing holes partially surround a chip mounting region.

8. The light-emitting device of claim 7, wherein the first portion comprises a second fixing hole having circular shape and a third fixing hole having semicircular shape.

9. The light-emitting device of claim 8, wherein the third fixing hole is arranged at the edge of the second portion.

10. The light-emitting device of claim 9, wherein third fixing holes are arranged at a first edge of the second portion, and at a second edge opposite to the first edge, and the third fixing holes disposed on a imaginary horizontal line.

11. The light-emitting device of claim 8, wherein the first fixing hole is exposed to the outside through the third fixing hole.

12. The light-emitting device of claim 8, wherein a planar area of the third fixing hole formed in the first lead frame is smaller than a planar area of the third fixing hole formed in the second lead frame.

13. The light-emitting device of claim 8, wherein the first fixing hole is disposed on the second fixing hole or the third fixing hole in vertical direction.