Method for the production of a book cover insert and book-type security document and book cover insert and book-type security document

• US 9,152,901 B2
• Filed: 03/08/2004
• Issued: 10/06/2015
• Est. Priority Date: 03/12/2003
• Status: Active Grant

• Current Assignee: Bundesdruckerei GmbH (Government of Germany)
• Original Assignee: Bundesdruckerei GmbH (Government of Germany)
• Inventors: Hoeppner, Harald, Radtke, Michael, Paeschke, Manfred, Ehreke, Jens, Seidel, Rainer, Knebel, Michael, Mrtens, Detlef, Ler, Thomas
• Primary Examiner(s): WALSH, DANIEL I
• Application Number:
  US10/549,047
• Publication Number:
  US 20060202795A1
• Time in Patent Office: 4,229 Days
• US Class Current: 1/1
• CPC Class Codes: B42D 25/29 Securities; Bank notes
• CPC Class Codes: G06K 19/025 the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs methods for testing the genuineness of valuable papers, e.g. banknotes or passports G07D7/00; constructional features of booklets and the like B42D
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a method for the production of a book cover insert (11) and to a method for the production of a book-type security document (30) and also to a book cover insert and a book-type security document, in which at least one data carrier (22) that can be operated contactlessly is provided in a book cover insert (11). (In this respect FIG. 9).

Claims

1. A method for the production of a book cover insert for a book binding, characterized in that

at least one first layer, at least one second layer and at least one data carrier with microchip are provided,

a cutout or perforation for receiving at least one part of the data carrier is introduced into the at least one layer,

an adhesive layer is introduced at least on an inner side of the at least one first layer or a surface of the at least one data carrier with microchip which faces the inner side of the at least one first layer,

a further adhesive layer is introduced at least on an inner side of the at least one second layer or a surface of the at least one data carrier with microchip which faces the inner side of the at least one second layer,

the at least one data carrier with microchip is positioned to the cutout or perforation of the at least one layer and the at least one first layer, the data carrier with microchip and the at least one second layer are connected to one another under slight pressure to form a laminate layer encapsulation and in a subsequent working step after the production of the laminate layer encapsulation, a circumferential edge of the laminate layer encapsulation is stamped to a final format and the stamping to the final format is tailored to a reference size to which the perforation or the cutout is also geared,

the at least one first layer and the at least one second layer are formed from at least one polymeric laminate layer, so that the laminate layer encapsulation with the circumferential edge around at least the one data carrier is produced by the at least one first layer and the at least one second layer forming an outer peripheral closed edge wherein the outer peripheral closed edge, together with the at least one first layer and the at least one second layer completely embed and completely enclose the at least one data carrier on all sides of the data carrier to form the book cover insert for the book binding.

2. The method as claimed in claim 1, characterized in that the first and at least one further layer are produced from at least one thermoplastic film or from a sandwichlike film combination comprising PVC, ABS, PET-G, PET, PE, PP, PA or teslin.

3. The method as claimed in claim 1, characterized in that a material containing an antenna substrate is used for the first or at least one further layer.

4. The method as claimed in claim 1, characterized in that the at least one first layer and the at least one second layer are joined together by heating a hot melt adhesive and the upper limit for the heating temperature is limited to 200°

C.

5. The method as claimed in claim 1, characterized in that the at least one data carrier is positioned with respect to the at least one layer outside a gripper zone of the book cover insert.