Wafer level phosphor coating method and devices fabricated utilizing method
First Claim
1. A light emitting diode (LED) chip, comprising:
- an LED comprising a textured surface, said LED comprising semiconductor layers;
a contact on said semiconductor layers;
a pedestal in electrical contact with and formed on said contact; and
a coating at least partially covering said LED, said coating comprising a light emitting surface, said pedestal extending through to the light emitting surface of said coating and exposed at the surface of said coating for electrical contact, wherein said coating is conformal such that said coating comprises a substantially uniform thickness over said textured surface.
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Accused Products
Abstract
Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
255 Citations
58 Claims
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1. A light emitting diode (LED) chip, comprising:
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an LED comprising a textured surface, said LED comprising semiconductor layers; a contact on said semiconductor layers; a pedestal in electrical contact with and formed on said contact; and a coating at least partially covering said LED, said coating comprising a light emitting surface, said pedestal extending through to the light emitting surface of said coating and exposed at the surface of said coating for electrical contact, wherein said coating is conformal such that said coating comprises a substantially uniform thickness over said textured surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A light emitting diode (LED) chip, comprising:
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an LED mounted on a substrate, wherein a surface of said LED is textured for light extraction; an integral coating at least partially covering said LEDs and comprising a light emitting surface, said integral coating formed by at least partially covering said LED with said coating at the wafer level and curing said coating at the wafer level such that said integral coating completely covers the sides of said substrate; a contact on said LED; and a pedestal in electrical contact with said contact, said pedestal further extending through and to the light emitting surface of said coating and exposed at the light emitting surface of said coating. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A light emitting diode (LED) chip wafer, comprising:
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a plurality of LEDs comprising semiconductor layers, each of said LEDs comprising at least one textured surface to enhance light extraction, wherein said semiconductor layers are continuous between at least two of said plurality of LEDs; a plurality of contacts, each of said contacts being on one of said textured surfaces; a plurality of pedestals, each of which in electrical contact with and formed on one of said contacts; and a coating at least partially covering said LEDs and comprising a light emitting surface, at least some of said pedestals extending through said light emitting surface and exposed at the surface of said coating for electrical contact, wherein said coating is conformal such that said coating comprises a substantially uniform thickness over said at least one textured surface. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58)
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Specification