Electronic device provided with socket for card-shaped component

• US 9,167,722 B2
• Filed: 03/02/2011
• Issued: 10/20/2015
• Est. Priority Date: 03/02/2010
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Molex Incorporated
• Inventors: Nagasawa, Hideo
• Primary Examiner(s): PAPE, ZACHARY
• Application Number:
  US13/582,125
• Publication Number:
  US 20130194747A1
• Time in Patent Office: 1,693 Days
• Field of Search: 36167946-67954, 361688-723
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Claims

1. An electronic device, the electronic device comprising:

an electronic component socket, the electronic component socket accommodating an installable electronic component therein, the electronic component socket including a thermal connecting portion, the thermal connecting portion being connected thermally to the electronic component, the thermal connecting portion including a transporting member, the transporting member including an interior space, a vapor diffusing space, a coolant return flow space and an interference-preventing plate, a coolant being sealed within the interior space, the vapor diffusing space for diffusing vaporized coolant included within the interior space, condensed coolant flowing back to the coolant return flow space, the interference-preventing plate preventing interference between the vaporized coolant and the condensed coolant; and

a heat-dissipating portion.

2. The electronic device of claim 1, wherein, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

3. The electronic device of claim 2, wherein the thermal connecting portion further includes a heat-receiving member, the heat-receivinq member receiving heat produced by the electronic component.

4. The electronic device of claim 3, wherein the transporting member transports, to the heat-dissipating portion, heat received by the heat-receiving member.

5. The electronic device of claim 4, wherein the electronic component socket further includes an electrical pad, the electrical pad connecting electrically with a contact point provided at an end portion of the electronic component.

6. The electronic device of claim 5, wherein the heat-receiving member includes a thermally conducting pad, the thermally conducting pad being isolated from the electrical pad.

7. The electronic device of claim 6, wherein the transporting member further includes a recessed portion, the recessed portion mating with a raised portion, the raised portion being provided on the heat-dissipating portion.

8. The electronic device of claim 7, wherein the transporting member further includes a raised portion, the raised portion mating with a recessed portion, the recessed portion being provided in the heat-dissipating portion.

9. The electronic device of claim 8, wherein the transporting member further includes a first comb tooth-shaped member, the first comb tooth-shaped member mating with a second comb tooth-shaped member, the second comb tooth-shaped member being provided in the heat-dissipating portion.

10. The electronic device of claim 9, wherein the heat-receiving member receives heat from the electronic component upon insertion of the electronic component into the electronic component socket.

11. The electronic device of claim 10, wherein the transporting member transports heat from the heat-receiving member to the heat-dissipating portion so that the thermal connecting portion transports, to the heat-dissipating portion, heat produced by the electronic component inserted into an interior space of the socket.

12. The electronic device of claim 11, wherein the transporting member further includes a first end portion, the first end portion thermally contacting the heat-receiving member.

13. The electronic device of claim 12, wherein the transporting member further includes a second end portion, the second end portion being disposed opposite the first end portion, the second end portion thermally contacting the heat-dissipating portion.

14. The electronic device of claim 13, wherein the sealed coolant is vaporized by heat received from the heat-receiving member.

15. The electronic device of claim 14, wherein the vapor diffusing space causes the vaporized coolant to diffuse along a first direction.

16. The electronic device of claim 15, wherein pores cause the coolant, condensed in the process of diffusing from the first end portion to the second end portion, to move into the coolant return flow space.

17. The electronic device of claim 16, wherein the coolant return flow space causes the condensed coolant, moved to the coolant return flow space, to flow back along a second direction.

18. The electronic device of claim 17, wherein, upon establishment of an electrical connection in the electrical connecting portion, the thermal connecting portion thermally connects the electronic component and the electronic device.

19. The electronic device of claim 18, further comprising a warning portion, the warning portion indicating the state of thermal connection between the electronic component and the electronic device.