Light emitting diode package and light emitting module comprising the same

• US 9,172,020 B2
• Filed: 06/20/2014
• Issued: 10/27/2015
• Est. Priority Date: 10/27/2011
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Kim, Byoung Sung, Lim, Sang Eun, Lee, Jae Jin, Son, Yeoun Chul
• Primary Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US14/310,782
• Publication Number:
  US 20140299910A1
• Time in Patent Office: 494 Days
• Field of Search: 257/99
• US Class Current: 1/1
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.

Claims

1. A light emitting diode package, comprising:

a light emitting diode chip;

a lead frame comprising a chip area on which the light emitting diode chip is disposed; and

a package body comprising a cavity and supporting the lead frame,

wherein;

the chip area is exposed through the cavity;

the lead frame comprises a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area;

the first terminal group and the second terminal group each comprise a first terminal connected to the chip area and a second terminal separated from the chip area;

the second terminal of the first terminal group is exposed through the cavity; and

the second terminal of the second terminal group is buried in the package body and not exposed through the cavity.

2. The light emitting diode package of claim 1, wherein in the first terminal group, a width of the second terminal inside the package body is greater than a width of the second terminal outside the package body.

3. The light emitting diode package of claim 1, wherein a width of the second terminal of the first terminal group is greater than a width of the second terminal of the second terminal group inside the package body.

4. The light emitting diode package of claim 1, wherein in the first terminal group and/or in the second terminal group, a width of the first terminal is greater than a width of the second terminal outside the package body.

5. The light emitting diode package of claim 1, wherein each first terminal of the first terminal group and the second terminal group extends to opposite sides.

6. The light emitting diode package of claim 5, wherein each second terminal of the first terminal group and the second terminal group is disposed between the first terminals of the first terminal group and the second terminal group, respectively.

7. The light emitting diode package of claim 1, wherein the lead frame comprises a connection groove between the first terminal of the first terminal group and the first terminal of the second terminal group.

8. The light emitting diode package of claim 7, wherein the connection groove is partially exposed through the cavity.

9. The light emitting diode package of claim 1, wherein the first terminal of the first terminal group and the second terminal group comprises a connection hole buried in the package body.

10. The light emitting diode package of claim 1, wherein a width of the second terminal of the first terminal group is the same as a width of the second terminal of the second terminal group, outside the package body.

11. The light emitting diode package of claim 1, wherein a width of the first terminal of the first terminal group is the same as a width of the second terminal of the second terminal group, outside the package body.

12. The light emitting diode package of claim 1, wherein in the first terminal group, a width of the first terminal is less than a width of the second terminal inside the package body.

13. The light emitting diode package of claim 1, wherein in the second terminal group, a width of the second terminal is less than a width of the first terminal both inside and outside the package body.

14. The light emitting diode package of claim 1, wherein a width of the first terminal of the second terminal group is greater than a width of the first terminal of the first terminal group inside the package body.

15. The light emitting diode package of claim 1, wherein the lead frame comprises:

an upper flat section within the package body;

a lower flat section exposed outside of the package body; and

a connecting section within the package body, the connection section connecting the upper flat section and the lower flat section.

16. The light emitting diode package of claim 15, wherein the package body comprises an upper portion disposed on a first side of the lead frame and a lower portion disposed on a second side of the lead frame, and

wherein the lead frame comprises a connection hole through which the upper portion and the lower portion are connected to each other.

17. The light emitting diode package of claim 16, wherein the connection hole is formed in the upper flat section of the lead frame.

18. A light emitting module, comprising:

a printed circuit board;

a light emitting diode package disposed on the printed circuit board; and

a heat sink connected to the printed circuit board,

wherein the light emitting diode package comprises;

a light emitting diode chip;

a lead frame comprising a chip area on which the light emitting diode chip is disposed; and

a package body comprising a cavity and supporting the lead frame,

wherein;

the chip area is exposed through the cavity;

the lead frame comprises a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area;

the first terminal group and the second terminal group each comprise a first terminal connected to the chip area and a second terminal separated from the chip area;

the second terminal of the first terminal group is exposed through the cavity; and

the second terminal of the second terminal group is buried in the package body and not exposed through the cavity.

19. The light emitting module of claim 18, wherein the heat sink comprises zones comprising different numbers of heat dissipation fins.

20. The light emitting module of claim 19, wherein first zones of the heat sink disposed directly under the first terminals comprise a greater number of heat dissipation fins than that of a second zone of the heat sink disposed directly under the second terminals.