Methods for manufacturing ultrasound transducers and other components

• US 9,173,047 B2
• Filed: 11/26/2012
• Issued: 10/27/2015
• Est. Priority Date: 09/18/2008
• Status: Active Grant

• Current Assignee: FUJIFILM SonoSite, Inc. (Fujifilm Holdings Corporation)
• Original Assignee: FUJIFILM SonoSite, Inc. (Fujifilm Holdings Corporation)
• Inventors: Lukacs, Marc, Chaggares, Nicholas Christopher, Hirson, Desmond, Pang, Guofeng
• Primary Examiner(s): DOUGHERTY, THOMAS M
• Application Number:
  US13/685,673
• Publication Number:
  US 20130207519A1
• Time in Patent Office: 1,065 Days
• Field of Search: 310/334, 310/335
• US Class Current: 1/1
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: H10N 30/00 Piezoelectric or electrostrictive devices integrated devices or assemblies of multiple devices H10N39/00
• CPC Class Codes: H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
• CPC Class Codes: H10N 30/50 having a stacked or multilayer structure

Abstract

The invention features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the inventions provides methods of patterning electrodes, e.g., in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layer for an ultrasound transducer. The invention also features ultrasound transducers produced by the methods described herein.

Claims

1. An ultrasound transducer comprising a lens assembly having a top and bottom surface, an array transducer stack having a top and bottom surface, and a matching layer adhering to the bottom surface of the lens assembly and the top surface of the transducer stack, wherein the transducer stack comprises a piezoelectric layer and a plurality of array elements, the top surface of the transducer stack comprises a plurality of spacers not disposed over the plurality of array elements, and the bottom of the lens assembly contacts the plurality of spacers.

2. The transducer of claim 1, wherein the transducer stack further comprises a plurality of first kerf slots that extend a predetermined depth therein the stack, and wherein the plurality of first kerf slots define the plurality array elements.

3. The transducer of claim 2, further comprising a plurality of second kerf slots defined therein the piezoelectric stack, each second ken slot extending a predetermined depth therein the stack, wherein each second kerf slot is positioned adjacent to at least one first kerf slot and the plurality of second kerf slots define a plurality of array sub-elements.

4. The transducer of claim 1, wherein the lens assembly comprises a lens and a second matching layer forming the bottom surface of the assembly.

5. The transducer of claim 4, wherein the lens comprises Rexolite or TPX.

6. The transducer of claim 5, wherein the second matching layer comprises cyanoacrylate.

7. The transducer of claim 4, wherein the second matching layer adheres directly to the lens.

8. The transducer of claim 1, wherein the transducer stack further comprises third and fourth matching layers disposed between the piezoelectric layer and the matching layer adhering to the bottom surface of the lens assembly.

9. The transducer of claim 1, wherein the array elements operate at a center frequency of at least 20 MHz.

10. The transducer of claim 2, further comprising a connector having an electrode for each array element and a composite dielectric material comprising a matrix material and a particulate material on the bottom surface of the stack and a portion of the connector, wherein the matrix material is laser ablated at a lower fluence than the particulate material,

wherein the composite dielectric material is disposed over a portion of the bottom surface of the stack and the connector;

wherein a trench in the composite dielectric material connects each array element to one of the electrodes of the connector; and

wherein a metal deposited in each trench provides an electrical connection between each active element and one of the electrodes of the connector.