Shielded double-coil multilayer assembly for inductive detector

• US 9,182,514 B2
• Filed: 08/14/2012
• Issued: 11/10/2015
• Est. Priority Date: 09/02/2011
• Status: Active Grant

• Current Assignee: Tmss France
• Original Assignee: Schneider Electric Industries SAS (Schneider Electric SE)
• Inventors: Charrier, Pierre-Marie, Bernard, Jacques
• Primary Examiner(s): Assouad, Patrick
• Assistant Examiner(s): Brown, Lamarr
• Application Number:
  US13/585,247
• Publication Number:
  US 20130057300A1
• Time in Patent Office: 1,183 Days
• Field of Search: 324/629, 324/652, 324654-657
• US Class Current: 1/1
• CPC Class Codes: G01V 3/107 using compensating coil or loop arrangements

Abstract

The invention relates to a shielded double-coil multilayer assembly intended to be used in an inductive detector. This multilayer assembly comprises a plurality of stacked parallel separated layers, namely:

• • a layer (C1) comprising a first shielding element for a first coil,
  • a layer (C2) comprising all or part of a first coil,
  • a layer (C3) comprising all or part of a second coil,
  • a layer (C4) comprising a first shielding element for the second coil.

Claims

1. A multilayer assembly usable in an inductive detector, comprising:

at least four stacked parallel separated layers, wherein the layers include

a first layer comprising a first shielding element for a first coil,

a second layer comprising a first coil,

a third layer comprising a second coil,

a fourth layer comprising a first shielding element for the second coil, and in that said layers are separated from one another by connecting layers, one of said connecting layers, referred to as an intermediate connecting layer, having a determined thickness greater than those of the connecting layers separating the other layers from one another.

2. The multilayer assembly according to claim 1, further comprising:

an additional layer comprising a second element for shielding the first coil.

3. The multilayer assembly according to claim 1, further comprising:

an additional layer comprising a second element for shielding the second coil.

4. The multilayer assembly according to claim 1, further comprising:

an additional layer comprising a coil connected to the first coil.

5. The multilayer assembly according to claim 1, further comprising:

an additional layer comprising a coil connected to the second coil.

6. The multilayer assembly according to claim 1, wherein each coil is surrounded by an open shielding ring.

7. The multilayer assembly according to claim 1, wherein the multilayer assembly is formed by a monobloc multilayer printed circuit.

8. The multilayer assembly according to claim 1, further comprising:

a first multilayer printed circuit, a spacer strip forming the intermediate connecting layer and a second multilayer printed circuit, which are assembled together.

9. An inductive proximity detector comprising:

a casing in which an oscillating circuit is placed which is excited in resonance by a generator; and

a detection coil sensitive to a metal target to be detected,

wherein the oscillating circuit comprises a reference coil arranged in order to have a mutual inductance, with respect to the metal target to be detected, which is substantially less than that of the detection coil with respect to the metal target;

processing circuitry connected to the coils and configured to determine the presence or absence of the metal target in proximity to the detector; and

a multilayer assembly usable in an inductive detector comprising at least four stacked parallel separated layers, wherein the layers include a first layer comprising a first shielding element for a first coil, a second layer comprising a first coil, a third layer comprising a second coil, a fourth layer comprising a first shielding element for the second coil, and in that said layers are separated from one another by connecting layers, one of said connecting layers, referred to as an intermediate connecting layer, having a determined thickness greater than those of the connecting layers separating the other layers from one another,

wherein the detection coil is produced in the second layer of the multilayer assembly and the reference coil is formed in the third layer of the multilayer assembly.