Apparatus and method for baking glass substrate

• US 9,206,065 B2
• Filed: 08/02/2012
• Issued: 12/08/2015
• Est. Priority Date: 07/03/2012
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Ma, Tao, Ding, Tao, Liu, Ming, Song, Tao, Zhao, Guodong, Liu, Yijun
• Primary Examiner(s): Daniels, Matthew
• Assistant Examiner(s): Szewczyk, Cynthia
• Application Number:
  US13/641,664
• Publication Number:
  US 20140007620A1
• Time in Patent Office: 1,223 Days
• Field of Search: 65/291.9
• US Class Current: 1/1
• CPC Class Codes: C03B 32/00 Thermal after-treatment of glass products not provided for in groups C03B19/00 , C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
• CPC Class Codes: C03C 17/001 General methods for coating; Devices therefor
• CPC Class Codes: C03C 17/32 with synthetic or natural resins C03C17/30 takes precedence
• CPC Class Codes: C03C 2218/31 Pre-treatment

Abstract

The present invention discloses an apparatus for baking a glass substrate, which includes: a baking oven, a support component, a temperature sensing device, a heating device, a cooling device, and a temperature controlling device. The present invention further discloses a method for baking a glass substrate. The present invention is capable of dynamically controlling the temperature of the support component, which contacts the glass substrate. The temperature of the glass substrate keeps identical and the temperature of the support component keep identical, so as to prevent a Mura defect appearing on the glass substrate.

Claims

1. An apparatus for baking a glass substrate, comprising:

a baking oven utilized to heat the glass substrate;

a support component for supporting the glass substrate;

a temperature sensing device for sensing a temperature of the glass substrate;

a heating device placed at an inside or on a surface of the support component, or coupled to the support component, utilized to heat the support component;

a cooling device utilized to cool the support component;

and a temperature controlling device utilized to receive temperature data transmitted from the temperature sensing device, and to control the heating device to heat the support component, or to control the cooling device to cool the support component according to the temperature data;

wherein the temperature sensing device comprises;

a first temperature sensor for sensing a first temperature data of the glass substrate, the first temperature data being a temperature on a first region of the glass substrate, wherein the first region is a region of the glass substrate without contacting the support component;

a second temperature sensor for sensing a second temperature data of the glass substrate, the second temperature data being a temperature on a second region of the glass substrate, wherein the second region is a region of the glass substrate contacting the support component, and wherein the second temperature sensor is disposed above the second region; and

a third temperature sensor disposed inside the support component and near a portion that the support component contacts the glass substrate for sensing a third temperature data of the support component;

the temperature sensing device electrically coupled to the temperature controlling device;

the temperature controlling device electrically coupled to the heating device and the cooling device;

the baking oven heating the glass substrate through an infrared heater.

2. The apparatus for baking a glass substrate according to claim 1, wherein the temperature controlling device is further utilized to compare the first temperature data and the second temperature data.

3. The apparatus for baking a glass substrate according to claim 2, wherein under a condition that the first temperature data is larger than the second temperature data, the temperature controlling device is further utilized to control the heating device to heat the support component;

under a condition that the first temperature data is less than the second temperature data, the temperature controlling device is further utilized to control the cooling device to cool the support component.

4. The apparatus for baking a glass substrate according to claim 3, wherein, the third temperature data being a temperature on the support component.

5. The apparatus for baking a glass substrate according to claim 4, wherein before the baking oven heats the glass substrate, the temperature controlling device is further utilized to control the heating device and the cooling device to adjust the temperature of the support component according to the third temperature data, so that the third temperature data is consistent with an oven temperature of the baking oven.