Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow

• US 9,214,315 B2
• Filed: 12/22/2014
• Issued: 12/15/2015
• Est. Priority Date: 01/29/2010
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Silveira, Fernando M., Tavassoli, Hamid, Zhou, Xiaoping, Nevil, Shane C., Buchberger, Douglas A., Mays, Brad L., Tsong, Tina, Mahadeswaraswamy, Chetan, Pattar, Yashaswini B., Nguyen, Duy D., Merry, Walter R.
• Primary Examiner(s): PASCHALL, MARK H
• Application Number:
  US14/580,184
• Publication Number:
  US 20150316941A1
• Time in Patent Office: 358 Days
• Field of Search: 219/121.41, 219/121.43, 219/121.52, 219/121.49, 219/121.4, 118/723.R, 118/724, 118/725, 156/345.34, 156/345.47, 156/345.52, 156/345.53
• US Class Current: 1/1
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01J 37/20 Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support introducing the objects H01J37/18
• CPC Class Codes: H01J 37/32724 Temperature
• CPC Class Codes: H01J 37/32908 Utilities
• CPC Class Codes: H01J 37/32926 Software, data control or modelling
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.

Claims

1. A method of controlling a temperature of a chuck in a plasma processing apparatus, the method comprising:

providing a first heat transfer fluid at a first temperature to the chuck via a first supply line and a first return line coupling the chuck to a first heat transfer fluid reservoir;

providing a second heat transfer fluid at a second temperature to the chuck via a second supply line and a second return line coupling the chuck to a second heat transfer fluid reservoir;

controlling a first valve coupling the first heat transfer fluid reservoir with the first supply line and controlling a second valve coupling the second heat transfer fluid reservoir with the second supply line; and

equalizing a level of the first heat transfer fluid reservoir with a level of the second heat transfer fluid reservoir by flowing either the first or second heat transfer fluid through a passive leveling pipe coupling the first heat transfer fluid reservoir to the second heat transfer fluid reservoir.

2. The method of claim 1, further comprising:

modulating a pulse width modulation duty cycle driving at least one of the first and second valves between a fully open state and a fully closed state, such that one of the first and second valves is to be in the off state when the other of the first and second valves is in the on state.

3. The method of claim 2, wherein the pulse width modulation duty cycle is modulated based at least on a total power applied to a plasma, the total power being a weighted sum of at least a first bias power from an RF generator operating between approximately 2 MHz and 60 MHz and a second bias power from an RF generator operating between approximately 2 MHZ and 60 MHz.

4. The method of claim 1, further comprising splitting a fluid flow bypass returning heat transfer fluid to the first heat transfer fluid reservoir with the first valve a first valve:

bypass ratio between 1;

0.8 and 1;

0.2.

5. The method of claim 1, wherein the duration the first valve is opened is dependent on the pulse width modulation duty cycle as a percentage of a time proportioning cycle, the time proportioning cycle being more than one order of magnitude longer than the time required to change the state of the first valve.

6. The method of claim 5, wherein the time proportioning cycle duration is less than half the thermal time constant of the chuck.

7. The apparatus as in claim 6, wherein the time proportioning cycle duration is between 4 and 6 seconds.