Flexible printed circuit integrated with conductive layer

• US 9,237,645 B2
• Filed: 04/26/2012
• Issued: 01/12/2016
• Est. Priority Date: 04/28/2011
• Status: Active Grant

• Current Assignee: Kaneka Corporation
• Original Assignee: Kaneka Corporation
• Inventors: Kido, Masayoshi, Sekito, Yoshihide
• Primary Examiner(s): Ngo, Hung V
• Application Number:
  US14/113,729
• Publication Number:
  US 20140054081A1
• Time in Patent Office: 1,356 Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence

Abstract

A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.

Claims

1. A conductive-layer-integrated flexible printed circuit board comprising:

(A) an electromagnetic-shielding conductive layer;

(B) an insulator film; and

(C) a wiring-pattern-equipped film,

the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order,

the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.

2. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1, wherein the insulator film (B) contains (c) fine particles containing at least one type of element selected from the group consisting of phosphorus, aluminum, and magnesium.

3. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1, wherein the electromagnetic-shielding conductive layer (A) contains (f) at least one type of element selected from the group consisting of silver, copper, aluminum, and nickel.

4. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1, wherein the insulator film (B) is made from a resin composition containing (d) a thermosetting resin.

5. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1, wherein the insulator film (B) is made from a photosensitive resin composition containing (e) a photopolymerization initiator.