Module and electronic apparatus

• US 9,243,909 B2
• Filed: 05/23/2012
• Issued: 01/26/2016
• Est. Priority Date: 05/31/2011
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Sakuma, Masayasu, Kobayashi, Yoshihiro, Kitamura, Shojiro, Chino, Taketo, Ogami, Michiharu
• Primary Examiner(s): WEST, PAUL M
• Application Number:
  US13/478,619
• Publication Number:
  US 20120304765A1
• Time in Patent Office: 1,343 Days
• US Class Current: 1/1
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01D 11/30 Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
• CPC Class Codes: G01P 1/00 Details of instruments
• CPC Class Codes: G01P 1/02 Housings
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 1/026 for speed measuring devices, e.g. pulse generator
• CPC Class Codes: G01P 15/18 in two or more dimensions

Abstract

A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Claims

1. A module comprising:

a sensor device;

a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable to manipulate an angle between the mounting faces; and

a supporting member having a plurality of fixing faces,

wherein at least one of the plurality of fixing faces is provided with a clearance portion,

the sensor device and one of the plurality of fixing faces are bonded directly to each other,

the sensor device is disposed on a supporting member side of the mounting faces and at least a part of the sensor device is accommodated in the clearance portion,

each of the mounting faces is disposed along each of the fixing faces, and

the mounting substrate surrounds an exterior of the supporting member.

2. The module according to claim 1,

wherein normal lines of the fixing faces in the supporting member intersect each other.

3. The module according to claim 1,

wherein normal lines of the fixing faces in the supporting member are orthogonal to each other.

4. The module according to claim 1,

wherein the supporting member is a rectangular parallelepiped.

5. The module according to claim 1,

wherein the supporting member is provided with a penetration hole, and at least a part of the sensor device is accommodated in the penetration hole.

6. The module according to claim 1,

wherein a protruding portion is provided on at least one of the plurality of mounting faces and one of the plurality of fixing faces, and a hole portion is provided on another one of the plurality of mounting faces and another one of the plurality of fixing faces, and

the protruding portion and the hole portion engage with each other.

7. The module according to claim 1,

wherein a metallic material is used for the supporting member.

8. The module according to claim 1,

wherein a hard substrate is used as the mounting faces, and

a flexible substrate is connected between the mounting faces.

9. The module according to claim 1,

wherein the mounting faces include a first mounting face, a second mounting face, and a third mounting face,

the sensor device is one of a plurality of sensor devices, and

each of the plurality of sensor devices is mounted on a separate one of the first to third mounting faces, and detection axes of the sensor devices intersect each other.

10. The module according to claim 9,

wherein the sensor device is an angular velocity sensor or an acceleration sensor.

11. An electronic apparatus comprising:

the module according to claim 1.