Transmission of signals via a high-frequency waveguide

• US 9,246,205 B2
• Filed: 02/13/2012
• Issued: 01/26/2016
• Est. Priority Date: 02/18/2011
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Takeda, Takahiro, Komori, Kenji, Ohashi, Sho, Okada, Yasuhiro
• Primary Examiner(s): Poos, John
• Application Number:
  US13/984,092
• Publication Number:
  US 20130314182A1
• Time in Patent Office: 1,443 Days
• Field of Search: 333/137, 333/248, 333/249
• US Class Current: 1/1
• CPC Class Codes: H01P 3/00 Waveguides; Transmission lines of the waveguide type
• CPC Class Codes: H01P 3/16 Dielectric waveguides, i.e. without a longitudinal conductor
• CPC Class Codes: H04B 3/52 Systems for transmission between fixed stations via waveguides

Abstract

A signal transmission device comprises a high-frequency signal waveguide. The high-frequency signal waveguide is configured to transmit a high-frequency signal emitted from an electronic device. When the electronic device is at least proximate to a flat surface of the high-frequency signal waveguide, the high-frequency signal is directly coupled from the electronic device to the high-frequency signal waveguide and transmitted via the high-frequency signal waveguide.

Claims

1. A signal transmission device, comprising:

a high-frequency signal waveguide configured to transmit in a first direction a high-frequency signal emitted from an electronic device; and

a communication device connected or coupled to the high-frequency signal waveguide,

wherein,

when the electronic device is at least proximate to a surface of the high-frequency signal waveguide, the high-frequency signal is directly coupled in a second direction different than the first direction from the electronic device to the high-frequency signal waveguide and transmitted via the high-frequency signal waveguide to the communication device.

2. The signal transmission device according to claim 1, wherein, when a plurality of electronic devices are at least proximate to the high-frequency signal waveguide, the high-frequency signal is transmitted between the plurality of electronic devices via the high-frequency signal waveguide.

3. The signal transmission device according to claim 1, further comprising a holding member that holds the high-frequency signal waveguide, wherein the high-frequency signal waveguide is arranged inside the holding member.

4. The signal transmission device according to claim 1, further comprising a holding member that holds the high-frequency signal waveguide, wherein at least a portion of the high-frequency signal waveguide is exposed from the holding member.

5. The signal transmission device according to claim 1, further comprising a holding member that holds the high-frequency signal waveguide, wherein the high-frequency signal waveguide is on the holding member.

6. The signal transmission device according to claim 1, wherein the high-frequency signal waveguide has a flat-plate shape.

7. The signal transmission device according to claim 1, wherein the high-frequency signal waveguide has a comb shape.

8. The signal transmission device according to claim 1, wherein the high-frequency signal waveguide has a lattice shape.

9. The signal transmission device according to claim 1, wherein the high-frequency signal waveguide has a spiral shape.

10. The signal transmission device according to claim 1, wherein a layer formed from a material that is different from a material included in the high-frequency signal waveguide is formed above the high-frequency signal waveguide, below the high-frequency signal waveguide, or above and below the high-frequency signal waveguide.

11. The signal transmission device according to claim 1, wherein the high-frequency signal waveguide comprises a dielectric material.

12. The signal transmission device according to claim 1, wherein the high-frequency signal waveguide comprises a magnetic material.

13. The signal transmission device according to claim 1, wherein a wavelength of a carrier frequency in the high-frequency signal is greater than or equal to 0.1 mm and less than or equal to 10 cm.

16. The signal transmission device of claim 1, wherein when the electronic device is at least proximate to the surface of the high-frequency signal waveguide, the high-frequency waveguide is configured to receive and transmit the high-frequency signal even when the high-frequency waveguide is in a non-contact state with the electronic device.

14. An electronic device, comprising:

a communication device; and

a high-frequency signal waveguide that transmits a high-frequency signal emitted from the communication device,

wherein,

when the high-frequency signal waveguide is at least proximate to a surface of a high-frequency signal waveguide disposed outside of the electronic device, the high-frequency signal is directly coupled from the electronic device to the high-frequency signal waveguide disposed outside of the electronic device,

the high-frequency signal waveguide disposed outside of the electronic device is configured to transmit the high-frequency signal in a first direction, and

the high-frequency signal is directly coupled in a second direction different than the first direction from the electronic device to the high-frequency signal waveguide disposed outside of the electronic device.

15. The electronic device according to claim 14, further comprising a high-frequency signal transmission member that transmits the high-frequency signal emitted from the communication device to the high-frequency signal waveguide included in the electronic device.