Lamp having outer shell to radiate heat of light source

• US 9,249,967 B2
• Filed: 12/17/2013
• Issued: 02/02/2016
• Est. Priority Date: 04/08/2005
• Status: Expired due to Fees

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Osawa, Shigeru, Morikawa, Kazuto
• Primary Examiner(s): McManmon, Mary
• Application Number:
  US14/108,854
• Publication Number:
  US 20140104837A1
• Time in Patent Office: 777 Days
• Field of Search: 362/363, 362/373
• US Class Current: 1/1
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 17/101 permanently, e.g. welding, gluing or riveting
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/30 Driver circuits
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.

Claims

1. A light source comprising:

a single, continuous board having a first surface and a second surface which is an opposite side with respect to the first surface, the first and second surfaces being flat;

a plurality of light-emitting diodes mounted on mounting positions of the first surface of the board such that the diodes overlap the board when viewed in a first direction perpendicular to the first and second surfaces of the board; and

a thermal diffusion layer disposed on the second surface of the board and including portions corresponding to the mounting positions of the light-emitting diodes, the thermal diffusion layer having a thickness less than a thickness of the board in the first direction perpendicular to the first and second surfaces of the board,

wherein the portions of the thermal diffusion layer overlap the second surface of the board when viewed in a second direction perpendicular to the first and second surfaces of the board, the second direction being opposite to the first direction,

wherein elongated spaces are formed between the portions of the thermal diffusion layer and disposed on a second surface side of the board, each of the elongated spaces extending in directions so as to cross imaginary lines that connect adjacent ones of the portions to each other, and

wherein the thermal diffusion layer is not formed in the elongated spaces.

2. The light source according to claim 1, further comprising:

a pattern layer disposed on the first surface.

3. The light source according to claim 1, wherein:

the board includes a screw hole, the screw hole comprising a through hole connecting the first surface and the second surface; and

the second surface includes a portion where the thermal diffusion layer is not formed immediately around the through hole.

4. The light source according to claim 3, wherein the portion where the thermal diffusion layer is not formed connects to the elongated spaces.

5. The light source according to claim 1, wherein the elongated spaces extend through an entire thickness of the thermal diffusion layer in the first direction perpendicular to the first and second surfaces of the board.

6. The light source according to claim 1, wherein the elongated spaces extend from a first surface of the thermal diffusion layer facing the second surface of the board to a second surface of the thermal diffusion layer opposite to the first surface of the thermal diffusion layer.

7. A lamp comprising:

a light source support; and

a light source which is supported on the light source support, the light source comprising;

a board having a first surface and a second surface which is an opposite side with respect to the first surface;

a plurality of light-emitting diodes mounted on mounting positions of the first surface of the board such that the diodes overlap the board when viewed in a first direction perpendicular to the first and second surfaces of the board; and

a thermal diffusion layer disposed on the second surface of the board and including portions corresponding to the mounting positions of the light-emitting diodes,

wherein the portions of the thermal diffusion layer overlap the second surface of the board when viewed in a second direction perpendicular to the first and second surfaces of the board, the second direction being opposite to the first direction,

wherein elongated spaces are formed between the portions of the thermal diffusion layer on the second surface of the board, each of the elongated spaces extending in directions so as to cross imaginary lines that connect adjacent ones of the portions to each other, and

wherein the thermal diffusion layer is not formed in the elongated spaces.