Cardiac or cerebral vessel microlead with electrode ring

• US 9,265,929 B2
• Filed: 05/16/2013
• Issued: 02/23/2016
• Est. Priority Date: 05/16/2012
• Status: Active Grant

• Current Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Original Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Inventors: Ollivier, Jean-Franois, Shan, Nicolas, D'Hiver, Philippe
• Primary Examiner(s): Flory, Christopher A
• Application Number:
  US13/895,974
• Publication Number:
  US 20130310898A1
• Time in Patent Office: 1,013 Days
• Field of Search: 607/2, 607/62, 600/372, 600/381, 128/898
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/372 Arrangements in connection with the implantation of stimulators
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A method of manufacturing a detection/stimulation lead for implantation into a venous, arterial, or lymphatic network is shown and described. The method includes providing a microcable comprising a sheath of insulating material covering an electrically conductive core. The method further includes surrounding a portion of the microcable with an electrically conductive metal ring. The method also includes crimping the ring such that the thickness of the sheath is penetrated by a portion of the metal ring and such that an electrical connection is formed between the metal ring and the electrically conductive core.

Claims

1. A method of manufacturing a detection/stimulation lead for implantation into a venous, arterial, or lymphatic network, comprising:

providing a microcable comprising a sheath of insulating material covering an electrically conductive core;

surrounding a portion of the microcable with an electrically conductive metal ring;

crimping the ring to achieve a differential crimping profile wherein the inner diameter of at least a central longitudinal portion of the conductive metal ring is smaller than the inner diameter of the longitudinal end portions on either side of the central portion, and such that the thickness of the sheath is penetrated by a portion of the metal ring and such that an electrical connection is formed between the metal ring and the electrically conductive core without removing insulating material at the penetration location; and

while crimping the ring, pushing insulating material beneath the metal ring to areas adjacent the edges of the metal ring to provide a seal.

2. The method of claim 1, further comprising:

continuing the crimping until the sheath penetration creates a puncture area in the sheath which is a continuous circumferential region and located in a plane perpendicular to the axis of the microcable and sheath.

3. The method of claim 1, further comprising:

discontinuing the crimping before the sheath penetration results in a continuous circumferential region.

4. The method of claim 3, further comprising:

forming a plurality of puncture areas of the sheath via the crimping, leaving areas of continuity of insulation between sheath parts located on either side of the ring.

5. The method of claim 4, further comprising:

forming the ring to include at least one interior relief adapted to define a puncture area of the corresponding sheath.

6. The method of claim 5, wherein said relief comprises a longitudinal profile positioned to share an elongated axis with the microcable.

7. The method of claim 6, wherein said relief comprises a thickened portion formed on an interior or exterior surface of the ring.

8. The method of claim 7, wherein, in a longitudinal direction, said relief does not extend up to an edge of the ring.

9. The method of claim 1, further comprising:

forming the ring to include a plurality of grooves on the ring'"'"'s inner face.

10. The method of claim 9, wherein the plurality of grooves comprise helical grooves.

11. The method of claim 1, wherein the wall thickness of the ring is between 20and 100 μ

m, wherein the length of the ring is between 0.5 and 1.5 mm, wherein the wall thickness of the sheath is between 5 and 50 μ

m, and wherein the material of the ring comprises an alloy of platinum-iridium or palladium.

12. The method of claim 1, wherein the surface material of the microcable comprises an alloy of the group:

MP35N or MP35NLT.

13. The method of claim 1, wherein the sheath comprises an electrically insulating polymer material selected from the following group:

polyurethanes (PU), polyester (PET), polyamides (PA), polycarbonates (PC), polyimides, fluoropolymers, polyether-ether-ketone (PEEK), poly-p-xylylene (parylene), polymethyl methacrylate (PMM), PTFE (polytetrafluoroethylene), FEP (perfluorinated propylene), PFA (perfluoroalkoxy copolymer resin), THV (tetrafluoroethylene, hexafluoropropylene, fluoride vinylidene), PVDF (polyvinylidene fluoride), EFEP (ethylene fluorinated ethylene propylene) and ETFE (ethylene tetrafluoroethylene).

14. The method of claim 1, wherein the differential crimping profile is achieved by crimping the electrically conductive metal ring to penetrate the sheath, wherein the ring is locally crimped with a greater force at the central portion of the ring than at the end portions on either side of the central portion.

15. The method of claim 1, wherein the differential crimping profile is achieved by crimping the electrically conductive metal ring to penetrate the sheath, wherein the ring comprises a variable longitudinal profile on the inner surface of the ring defining a smaller diameter in the central portion than at the end portions on either side of the central portion, and crimping the ring with a crimping tool having a constant longitudinal profile.

16. The method of claim 1, wherein the differential crimping profile is achieved by crimping the electrically conductive metal ring to penetrate the sheath, wherein the ring comprises one or more reliefs on the inner surface of the ring, the one or more reliefs creating a portion of the inner surface having a reduced diameter.