Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)
First Claim
1. A die comprising:
- a substrate;
at least one dielectric layer;
a component; and
a plurality of vias positioned at least partially around the component, wherein at least one via from the plurality of vias, comprises a ferromagnetic material.
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Accused Products
Abstract
Some implementations provide a die that includes a magnetoresistive random access memory (MRAM) cell array that includes several MRAM cells. The die also includes a first ferromagnetic layer positioned above the MRAM cell array, a second ferromagnetic layer positioned below the MRAM cell array, and several vias positioned around at least one MRAM cell. The via comprising a ferromagnetic material. In some implementations, the first ferromagnetic layer, the second ferromagnetic layer and the several vias define a magnetic shield for the MRAM cell array. The MRAM cell may include a magnetic tunnel junction (MTJ). In some implementations, the several vias traverse at least a metal layer and a dielectric layer of the die. In some implementations, the vias are through substrate vias. In some implementations, the ferromagnetic material has high permeability and high B saturation.
10 Citations
47 Claims
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1. A die comprising:
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a substrate; at least one dielectric layer; a component; and a plurality of vias positioned at least partially around the component, wherein at least one via from the plurality of vias, comprises a ferromagnetic material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for fabricating a die that includes a magnetic shield, comprising:
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providing a die that includes a substrate, at least one dielectric layer, and a component; and forming a plurality of vias positioned at least partially around the component, wherein at least one via from the plurality of vias, comprises a ferromagnetic material. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A die comprising:
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a substrate; at least one dielectric layer; a component; and a first shielding means traversing the substrate and the at least one dielectric layer, the first shielding means configured to provide shielding of the component from a side magnetic field traversing a side portion of the die. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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28. A die package comprising:
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a packaging substrate; a die coupled to the packaging substrate; a molding surrounding the die; and a plurality of vias positioned at least partially around an outer perimeter of the die, the plurality of vias formed in at least the molding, wherein at least one via from the plurality of vias, comprises a ferromagnetic material. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35)
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36. A method for providing a die package that includes a magnetic shield, comprising:
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providing a packaging substrate; providing a die coupled to the packaging substrate; providing a molding surrounding the die; and forming a plurality of vias positioned at least partially around an outer perimeter of the die, the plurality of vias formed in at least the molding, wherein at least one via from the plurality of vias, comprises a ferromagnetic material. - View Dependent Claims (37, 38, 39, 40, 41)
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42. A die package comprising:
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a packaging substrate; a die coupled to the packaging substrate; a molding surrounding the die; and a first shielding means traversing the molding surrounding the die, the first shielding means configured to provide shielding of the die from a side magnetic field traversing a side portion of the die package. - View Dependent Claims (43, 44, 45, 46, 47)
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Specification