Optoelectronic device and method for producing optoelectronic devices

• US 9,281,301 B2
• Filed: 05/19/2011
• Issued: 03/08/2016
• Est. Priority Date: 05/19/2011
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Haslbeck, Stephan, Foerste, Markus, Schwind, Michael, Haushalter, Martin, Halbritter, Hubert, Mllmer, Frank
• Primary Examiner(s): Lee, Eugene
• Application Number:
  US14/118,367
• Publication Number:
  US 20140191253A1
• Time in Patent Office: 1,755 Days
• Field of Search: 438/24, 438/27, 257/88, 257/98, 257/704
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.

Claims

1. An optoelectronic device comprising:

an optoelectronic component that receives or generates radiation;

a frame having a cavity, the optoelectronic component arranged in said cavity;

a connection carrier to which the optoelectronic component is fixed, wherein the connection carrier is a circuit board and has a plated through hole through the connection carrier, the plated through hole being an opening for an air exchange between the cavity and the environment;

a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component,

an ambient light sensor, wherein the cover defines a shortwave edge of the sensitivity of the sensor, and

a filter that defines the longwave edge of the sensitivity distribution such that the sensitivity distribution of the ambient light sensor simulates a sensitivity distribution of a human eye.

2. The optoelectronic device according to claim 1, wherein the connection carrier is arranged on a side of the frame facing away from the cover.

3. The optoelectronic device according to claim 1, further comprising contact areas for the external electrical contact-making on a side facing away from the radiation passage area, and the contact areas electrically connect to the optoelectronic component via plated-through holes through the connection carrier.

4. The optoelectronic device according to claim 1, wherein the cover is a film containing a polyimide.

5. The optoelectronic device according to claim 1, wherein the frame, the connection carrier and the cover terminate flush at least along one direction.

6. The optoelectronic device according to claim 1, wherein the cavity has an undercut region in a direction running from the cover to the optoelectronic component.

7. The optoelectronic device according to claim 1, wherein the cavity has a region that tapers at least regionally from the cover in a direction of the optoelectronic component.

8. The optoelectronic device according claim 1, further comprising a further optoelectronic component, which together with the optoelectronic component forms an emitter-detector pair.

9. The optoelectronic device according to claim 8, wherein the further optoelectronic component is arranged in a further cavity and the further cavity is spaced apart from the cavity.

10. The optoelectronic device according to claim 1, which is a proximity sensor and an ambient light sensor.

11. The optoelectronic device according to claim 1, further comprising a further optoelectronic component, wherein the further optoelectronic component is the ambient light sensor.

12. The optoelectronic device according to claim 1, wherein the plated through hole is a cutout whose side areas are provided with an electrically conductive contact coating, said contact coating electrically connected to contact areas formed on a rear side of the connection carrier facing away from the optoelectronic component.

13. The optoelectronic device according to claim 1, wherein the covering is a film that withstands temperature loads of at least 250°

C.

14. The optoelectronic device according to claim 1, wherein the ambient light sensor is an integrated circuit having a photosensitive region.

15. A method of producing a plurality of optoelectronic devices comprising:

a) providing a connection carrier assemblage;

b) arranging optoelectronic components on the connection carrier assemblage;

c) positioning a frame element having a plurality of cavities on the connection carrier assemblage such that the optoelectronic components are respectively arranged in a cavity;

d) arranging a cover on the frame element; and

e) severing the connection carrier assemblage into a plurality of connection carriers on each of which at least one optoelectronic component and a frame having a cavity is arranged, wherein each connection carrier is a circuit board and comprises a plated through hole that is an opening for air exchange between the cavities and the surrounding environment,

wherein the optoelectronic devices comprise an ambient light sensor, and a filter that defines the longwave edge of the sensitivity distribution such that the sensitivity distribution of the ambient light sensor simulates a sensitivity distribution of a human eye, and the cover defines a shortwave edge of the sensitivity of the ambient light sensor.

16. The method according to claim 15, wherein the cover, the frame element and the connection carrier assemblage are severed in e).