Display with vias for concealed printed circuit and component attachment
First Claim
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1. An electronic device comprising:
- a display having an array of display pixels formed on a polymer substrate layer with vias, wherein the polymer substrate layer extends under the entire array of display pixels, wherein the array of display pixels includes first and second adjacent display pixels, and wherein one of the vias is located between the first and second adjacent display pixels;
electroplated metal sidewalls in the vias;
a printed circuit substrate coupled to the polymer substrate layer; and
display driver circuitry mounted to the printed circuit substrate, wherein the printed circuit substrate includes conductive traces electrically coupled between at least one of the vias and the display driver circuitry.
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Accused Products
Abstract
An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.
112 Citations
28 Claims
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1. An electronic device comprising:
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a display having an array of display pixels formed on a polymer substrate layer with vias, wherein the polymer substrate layer extends under the entire array of display pixels, wherein the array of display pixels includes first and second adjacent display pixels, and wherein one of the vias is located between the first and second adjacent display pixels; electroplated metal sidewalls in the vias; a printed circuit substrate coupled to the polymer substrate layer; and display driver circuitry mounted to the printed circuit substrate, wherein the printed circuit substrate includes conductive traces electrically coupled between at least one of the vias and the display driver circuitry. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 28)
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14. An electronic device, comprising:
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a housing; a display mounted in the housing, wherein the display has opposing front and rear surfaces, wherein the front surface is viewable from outside of the housing, and wherein the display includes a substrate layer with electroplated vias, a light-emitting diode layer, and a sealant layer, and wherein the light-emitting diode layer is interposed between the sealant layer and the substrate layer; and a jumper structure coupled to the substrate layer, wherein the jumper structure comprises at least one conductive trace that routes signals from a first one of the electroplated vias to a second one of the electroplated vias. - View Dependent Claims (15, 16, 17, 23, 24, 25, 26)
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18. Apparatus, comprising:
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an organic light-emitting diode display having a substrate layer, a layer of light-emitting diodes on the substrate layer, and a polymer sealant layer on the light-emitting diode layer, wherein the substrate layer comprises vias; display driver circuitry mounted on a first printed circuit substrate; and a second printed circuit substrate electrically connected between the vias and the first printed circuit substrate, wherein the second printed circuit substrate comprises traces that route signals between the display driver circuitry and the organic light-emitting diode display and includes a contact that is electrically connected to one of the vias. - View Dependent Claims (19, 20, 21, 22, 27)
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Specification